- Series:
-
- Material:
-
- Thickness:
-
- Usage:
-
- Outline:
-
- Backing,Carrier:
-
- Thermal Resistivity:
-
- Thermal Conductivity:
-
- Electus conditionibus;
Odonata Lepidoptera products 53
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Usage | Adhesive | Outline | Backing,Carrier | Thermal Resistivity | Thermal Conductivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Usage | Adhesive | Outline | Backing,Carrier | Thermal Resistivity | Thermal Conductivity | ||
Bergquist |
1,336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD TO-220 W/ADH .009" SP9
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | TO-220 | Adhesive - One Side | 19.05mm x 12.70mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Bergquist |
11,523
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .009" SP900
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | TO-220 | - | 19.05mm x 12.70mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Bergquist |
6,855
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .009" SP900
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | TO-220 | - | 19.05mm x 12.70mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Bergquist |
35,621
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-247 .009" SP900
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | TO-218,TO-220,TO-247 | - | 25.40mm x 19.05mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Bergquist |
82
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 8"X16" .040" GP US
|
Gap Pad VO | Silicone Elastomer | 0.0400" (1.016mm) | - | Tacky - Both Sides | 406.40mm x 203.20mm | Fiberglass | - | 1.0 W/m-K | ||||
Laird Technologies - Thermal Materials |
126
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF640 DF 8.5" X 9.0"
|
Tflex SF600 DF | Non-Silicone,Boron Nitride Filled | 0.0400" (1.016mm) | - | Tacky - One Side | 228.60mm x 215.90mm | - | - | 3.0 W/m-K | ||||
Laird Technologies - Thermal Materials |
109
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF660 DF 8.5" X 9.0"
|
Tflex SF600 DF | Non-Silicone,Boron Nitride Filled | 0.0600" (1.524mm) | - | Tacky - One Side | 228.60mm x 215.90mm | - | - | 3.0 W/m-K | ||||
Bergquist |
154
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 8"X16" .125" GP US
|
Gap Pad VO | Silicone Elastomer | 0.125" (3.18mm) | - | Tacky - Both Sides | 406.40mm x 203.20mm | Fiberglass | - | 1.0 W/m-K | ||||
Bergquist |
7,459
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK PAD TO-220
|
Sil-Pad 1000 | Silicone Rubber | 0.0090" (0.229mm) | TO-220 | - | 19.05mm x 12.70mm | Fiberglass | 0.35°C/W | 1.2 W/m-K | ||||
Bergquist |
1,624
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .009" SP1000
|
Sil-Pad 1000 | Silicone Rubber | 0.0090" (0.229mm) | TO-220 | - | 19.05mm x 12.70mm | Fiberglass | 0.35°C/W | 1.2 W/m-K | ||||
Bergquist |
9,603
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .009" SP900
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | TO-218,TO-220,TO-247 | - | 21.84mm x 18.80mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Laird Technologies - Thermal Materials |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF620DF 8.5X9"
|
Tflex SF600 DF | Non-Silicone,Boron Nitride Filled | 0.0200" (0.508mm) | - | Tacky - One Side | 228.60mm x 215.90mm | - | - | 2.8 W/m-K | ||||
Bergquist |
1,116
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD SIP .009" SP900
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | SIP | - | 36.83mm x 21.29mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Bergquist |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 8"X16" .020" GP US
|
Gap Pad VO | Silicone Elastomer | 0.0200" (0.508mm) | - | Tacky - Both Sides | 406.40mm x 203.20mm | Fiberglass | - | 1.0 W/m-K | ||||
Bergquist |
42
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 8X16" .060" GP US
|
Gap Pad VO | Silicone Elastomer | 0.0600" (1.524mm) | - | Tacky - Both Sides | 406.40mm x 203.20mm | Fiberglass | - | 1.0 W/m-K | ||||
Bergquist |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 8"X16" .080" GP US
|
Gap Pad VO | Silicone Elastomer | 0.0800" (2.032mm) | - | Tacky - Both Sides | 406.40mm x 203.20mm | Fiberglass | - | 1.0 W/m-K | ||||
Bergquist |
93
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 8"X16" .125" GP ADH
|
Gap Pad VO | Silicone Elastomer | 0.125" (3.18mm) | - | Adhesive - One Side | 406.40mm x 203.20mm | Sil-Pad | - | 1.0 W/m-K | ||||
Bergquist |
311
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .009" SP900
|
Sil-Pad 900-S | Silicone Rubber | 0.0090" (0.229mm) | TO-218,TO-220,TO-247 | - | 24.00mm x 21.01mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||||
Laird Technologies - Thermal Materials |
66
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF680 8.5X9"
|
Tflex SF600 | Non-Silicone,Boron Nitride Filled | 0.0800" (2.032mm) | - | - | 228.60mm x 215.90mm | - | - | 3.0 W/m-K | ||||
Laird Technologies - Thermal Materials |
13
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF600 9X9"
|
Tflex SF600 | Non-Silicone,Boron Nitride Filled | 0.100" (2.54mm) | - | - | 228.60mm x 228.60mm | - | - | 3.0 W/m-K |