- Series：
-
- Material：
-
- Outline：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 13
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
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t-Global Technology |
81
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 41.91mm x 28.96mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 4LEAD .005" Q3
|
Q-Pad 3 | Elastomer | Black | - | 39.62mm x 26.67mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .005" Q3
|
Q-Pad 3 | Elastomer | Black | - | 41.91mm x 28.96mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 39.70mm x 26.67mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 4LEAD 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 39.70mm x 26.67mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 6LEAD 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 39.37mm x 26.67mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 41.91mm x 28.96mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 41.91mm x 28.96mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | Silicone | White | Adhesive - Both Sides | 45.21mm x 31.75mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .005" Q3
|
Q-Pad 3 | Elastomer | Black | - | 31.75mm x 17.78mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .005" Q3
|
Q-Pad 3 | Elastomer | Black | - | 33.32mm x 19.35mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .005" Q3
|
Q-Pad 3 | Elastomer | Black | - | 45.21mm x 31.75mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
Q-PAD THERMAL INTER ADHES 1SIDE
|
Q-Pad 3 | Elastomer | Black | Adhesive - One Side | 39.70mm x 26.67mm | Fiberglass | 0.35°C/W | 2.0 W/m-K |
