- Adhesive：
-
- Outline：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 24
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Color | Thickness | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Color | Thickness | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Bergquist |
2,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP400
|
Sil-Pad 400 | Gray | 0.0090" (0.229mm) | - | 33.32mm x 19.35mm | Fiberglass | 1.40°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
3,676
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .007" SP400
|
Sil-Pad 400 | Gray | 0.0070" (0.178mm) | - | 41.91mm x 28.96mm | Fiberglass | 1.13°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
1,977
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP400
|
Sil-Pad 400 | Gray | 0.0090" (0.229mm) | - | 41.91mm x 28.96mm | Fiberglass | 1.40°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
1,501
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP900
|
Sil-Pad 900-S | Pink | 0.0090" (0.229mm) | - | 45.21mm x 31.75mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||
|
|
|
Bergquist |
1,670
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP400
|
Sil-Pad 400 | Gray | 0.0090" (0.229mm) | - | 39.70mm x 26.67mm | Fiberglass | 1.40°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
1,183
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP900
|
Sil-Pad 900-S | Pink | 0.0090" (0.229mm) | - | 41.91mm x 28.96mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||
|
|
|
Aavid，Thermal Division of Boyd Corporation |
10,455
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMASIL TO-3 THERMAL PAD
|
ThermalsilIII | Gray，Green | 0.0060" (0.152mm) | - | 42.04mm x 27.00mm | - | - | 0.9 W/m-K | ||
|
|
|
Bergquist |
565
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD TO-3 4LEAD .006" K10
|
Sil-Pad K-10 | Beige | 0.0060" (0.152mm) | - | 39.62mm x 26.67mm | Polyimide | - | 1.3 W/m-K | ||
|
|
|
Bergquist |
713
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .006" K10
|
Sil-Pad K-10 | Beige | 0.0060" (0.152mm) | - | 41.91mm x 28.96mm | Polyimide | - | 1.3 W/m-K | ||
|
|
|
Bergquist |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP400
|
Sil-Pad 400 | Gray | 0.0090" (0.229mm) | - | 41.91mm x 28.96mm | Fiberglass | 1.40°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
770
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD .007" SP400 CUSTOM
|
Sil-Pad 400 | Granite | 0.0070" (0.178mm) | Adhesive - One Side | 36.58mm x 25.40mm | Fiberglass | 1.13°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .009" SP400
|
Sil-Pad 400 | Gray | 0.0090" (0.229mm) | - | 45.21mm x 31.75mm | Fiberglass | 1.40°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD TO-3 W/ADH .009" SP900
|
Sil-Pad 900-S | Pink | 0.0090" (0.229mm) | Adhesive - One Side | 41.91mm x 28.96mm | Fiberglass | 0.61°C/W | 1.6 W/m-K | ||
|
|
|
Bergquist |
41
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .006" K10
|
Sil-Pad K-10 | Beige | 0.0060" (0.152mm) | - | 31.75mm x 17.78mm | Polyimide | - | 1.3 W/m-K | ||
|
|
|
Bergquist |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .006" K10
|
Sil-Pad K-10 | Beige | 0.0060" (0.152mm) | - | 45.21mm x 31.75mm | Polyimide | - | 1.3 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SIL-PAD 7403-09FR-10
|
Sil-Pad 400 | Gray | 0.0090" (0.229mm) | - | 36.58mm x 25.40mm | Fiberglass | 1.40°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SIL-PAD K-10
|
Sil-Pad K-10 | Beige | 0.0060" (0.152mm) | Adhesive - One Side | 39.70mm x 28.96mm | Polyimide | - | 1.3 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .006" K10
|
Sil-Pad K-10 | Beige | 0.0060" (0.152mm) | - | 33.32mm x 19.35mm | Polyimide | - | 1.3 W/m-K | ||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL INTERFACE PAD
|
ThermalsilIII | Gray，Green | 0.0060" (0.152mm) | - | 43.18mm x 30.15mm | - | - | 0.9 W/m-K | |||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-3 .007" SP400
|
Sil-Pad 400 | Gray | 0.0070" (0.178mm) | - | 41.91mm x 28.96mm | Fiberglass | 1.13°C/W | 0.9 W/m-K |
