- Series：
-
- Thickness：
-
- Outline：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 16
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Color | Thickness | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Color | Thickness | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
t-Global Technology |
81
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 41.91mm x 28.96mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
197
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL H48-2K TO-3 4LEAD 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 39.70mm x 26.67mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
40
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 41.91mm x 28.96mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 39.70mm x 26.67mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
65
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 41.91mm x 28.96mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
63
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 45.21mm x 31.75mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 41.91mm x 28.96mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL H48-2K TO-3 6LEAD 0.1MM
|
H48-2K | Red | 0.0039" (0.100mm) | - | 39.37mm x 26.67mm | - | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 39.70mm x 26.67mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 4LEAD 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 39.70mm x 26.67mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 6LEAD 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 39.37mm x 26.67mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 41.91mm x 28.96mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 41.91mm x 28.96mm | Viscose | - | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TI900 TO-3 0.12MM W/ADH
|
Ti900 | White | 0.0050" (0.127mm) | Adhesive - Both Sides | 45.21mm x 31.75mm | Viscose | - | 1.8 W/m-K | ||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
INSULATOR
|
In-Sil-8 | Gray | 0.0070" (0.178mm) | Adhesive - One Side | 41.91mm x 28.96mm | - | 0.33°C/W | - | |||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
INSULATOR
|
In-Sil-8 | Gray | 0.0060" (0.152mm) | - | 40.46mm x 27.94mm | - | 0.40°C/W | - |
