- Series：
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- Material：
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- Thermal Conductivity：
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- Electus conditionibus;
Odonata Lepidoptera products 9
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Outline | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Outline | Thermal Conductivity | |
|
|
|
t-Global Technology |
197
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL H48-2K TO-3 4LEAD 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 39.70mm x 26.67mm | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
40
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 41.91mm x 28.96mm | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
45
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2 TO-3 2MM
|
H48-2 | Silicone Elastomer | 0.0790" (2.007mm) | 41.91mm x 28.96mm | 2.2 W/m-K | ||
|
|
|
t-Global Technology |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 39.70mm x 26.67mm | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
65
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 41.91mm x 28.96mm | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
63
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 45.21mm x 31.75mm | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2K TO-3 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 41.91mm x 28.96mm | 1.8 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD H48-2 TO-3 2MM
|
H48-2 | Silicone Elastomer | 0.0790" (2.007mm) | 45.21mm x 31.75mm | 2.2 W/m-K | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL H48-2K TO-3 6LEAD 0.1MM
|
H48-2K | Silicone | 0.0039" (0.100mm) | 39.37mm x 26.67mm | 1.8 W/m-K |
