- Series：
-
- Material：
-
- Thickness：
-
- Outline：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 232
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Thickness | Usage | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Thickness | Usage | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
PAD WAVEBLOCK A008 3MM 400X200MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
3M |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3M(TM) THERMALLY CONDUC
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
L37-3F ROLL 50MX300MMX0.25MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Adafruit Industries LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK THERMAL TAPE - 3M 8810
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Adafruit Industries LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK THERMAL TAPE - 3M 8810
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
t-Global Technology |
4,974
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
L37-3 120X70X5.5MM
|
- | - | - | - | - | - | - | - | - | - | |||
|
|
t-Global Technology |
39
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
NON SILICONE 150X150X0.25MM
|
PC96 | - | - | - | - | - | - | - | - | - | |||
|
|
|
Laird Technologies - Thermal Materials |
6
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD340 GAP FILLER18X18"
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
5
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD340 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
4
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD360 GAP FILLER 18X18"
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
4
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD360 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD380 GAP FILLER 18X18"
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD380 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3100 GAP FILLER 18X18"
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3100 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3120 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3140 GAP FILLER 18X18"
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3140 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3160 GAP FILLER 18X18"
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD3160 DC1 18X18" COATED
|
- | - | - | - | - | - | - | - | - | - |
