- Series：
-
- Material：
-
- Adhesive：
-
- Outline：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 7
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Adhesive | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Bergquist |
4,797
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .007" SP400
|
Sil-Pad 400 | Silicone Rubber | - | 21.84mm x 18.80mm | Fiberglass | 1.13°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
6,384
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .007" SP400
|
Sil-Pad 400 | Silicone Rubber | - | 25.40mm x 19.05mm | Fiberglass | 1.13°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .007" SP400
|
Sil-Pad 400 | Silicone Rubber | Adhesive - One Side | 31.75mm x 25.40mm | Fiberglass | 1.13°C/W | 0.9 W/m-K | ||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
INSULATOR
|
In-Sil-8 | Silicone | Adhesive - One Side | 19.05mm x 12.70mm | - | 1.25°C/W，0.77°C/W | - | |||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
INSULATOR
|
In-Sil-8 | Silicone | Adhesive - One Side | 19.05mm x 12.70mm | - | 1.25°C/W，0.77°C/W | - | |||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
INSULATOR
|
In-Sil-8 | Silicone | Adhesive - One Side | 19.05mm x 10.41mm | - | 1.25°C/W，0.77°C/W | - | |||
|
|
Aavid，Thermal Division of Boyd Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
INSULATOR
|
In-Sil-8 | Silicone | Adhesive - One Side | 21.84mm x 18.80mm | - | 1.25°C/W，0.77°C/W | - |
