- Series：
-
- Material：
-
- Shape：
-
- Outline：
-
- Backing，Carrier：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 15
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Shape | Outline | Backing，Carrier | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Shape | Outline | Backing，Carrier | Thermal Conductivity | |
|
|
|
Laird Technologies - Thermal Materials |
109
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF660 DF 8.5" X 9.0"
|
Tflex SF600 DF | Non-Silicone，Boron Nitride Filled | Pink | Rectangle | 228.60mm x 215.90mm | - | 3.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
303
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX 660,DC1 9" X 9"
|
Tflex 600 | Silicone Elastomer | Blue-Violet | Square | 228.60mm x 228.60mm | - | 3.0 W/m-K | ||
|
|
|
Bergquist |
3
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GAP PAD EMI 8X16" .060"
|
Gap Pad EMI 1.0 | - | Black | Rectangle | 406.40mm x 203.20mm | Fiberglass | 1.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
8
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD460,DC1 9X9IN
|
Tflex HD400 | Silicone Elastomer | Blue | Square | 228.60mm x 228.60mm | - | 4.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD460,DC1 18X18IN
|
Tflex HD400 | Silicone Elastomer | Blue | Square | 457.20mm x 457.20mm | - | 4.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX XS460 9" X 9"
|
Tflex XS400 | Elastomer | Gray | Square | 228.60mm x 228.60mm | - | 2.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL GAPPAD .060 8X16""
|
Gap Pad VO | Silicone Elastomer | Black，Gray | Rectangle | 406.40mm x 203.20mm | Fiberglass | 1.3 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
7
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD760,DC1 9X9IN
|
Tflex HD700 | Silicone Elastomer | Pink | Square | 228.60mm x 228.60mm | - | 5.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HD760,DC1 18X18IN
|
Tflex HD700 | Silicone Elastomer | Pink | Square | 457.20mm x 457.20mm | - | 5.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HR460,DC1 9" X 9"
|
Tflex HR400 | Silicone Elastomer | Gray | Square | 228.60mm x 228.60mm | - | 1.8 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX 560,DC1 9" X 9"
|
Tflex 500 | Silicone Elastomer | Blue | Square | 228.60mm x 228.60mm | - | 2.8 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX HR660,DC1 9" X 9"
|
Tflex HR600 | Silicone Elastomer | Gray | Square | 228.60mm x 228.60mm | - | 3.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX 760,DC1 9" X 9"
|
Tflex 700 | Silicone | Gray | Square | 228.60mm x 228.60mm | - | 5.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF660 DF 17" X 18"
|
Tflex SF600 DF | Non-Silicone，Boron Nitride Filled | Pink | Rectangle | 431.80mm x 457.20mm | - | 3.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TFLEX SF660 18" X 18"
|
Tflex SF600 | Non-Silicone，Boron Nitride Filled | Pink | Square | 457.20mm x 457.20mm | - | 3.0 W/m-K |
