- Series:
-
- Material:
-
- Shape:
-
- Backing,Carrier:
-
- Thermal Resistivity:
-
- Thermal Conductivity:
-
- Electus conditionibus;
Odonata Lepidoptera products 6
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Shape | Thickness | Outline | Backing,Carrier | Thermal Resistivity | Thermal Conductivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Color | Shape | Thickness | Outline | Backing,Carrier | Thermal Resistivity | Thermal Conductivity | ||
Bergquist |
1,583
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD POWER MOD .005" Q3
|
Q-Pad 3 | Elastomer | Black | Rectangle | 0.0050" (0.127mm) | 38.10mm x 22.86mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||||
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD POWER MOD .005" Q3
|
Q-Pad 3 | Elastomer | Black | Rectangle | 0.0050" (0.127mm) | 63.50mm x 50.80mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||||
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD H48-2K POWER MOD 0.1MM
|
H48-2K | Silicone | Red | Rectangle | 0.0039" (0.100mm) | 63.50mm x 50.80mm | - | - | 1.8 W/m-K | ||||
t-Global Technology |
33
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD H48-2K POWER MOD 0.1MM
|
H48-2K | Silicone | Red | Rectangle | 0.0039" (0.100mm) | 38.10mm x 22.86mm | - | - | 1.8 W/m-K | ||||
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TGON 805,A0 POWER MODULE 0.005"
|
Tgon 805 | Graphite | Gray | - | 0.0050" (0.127mm) | 63.50mm x 50.80mm | - | 0.07°C/W | 5.0 W/m-K | ||||
t-Global Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD POWER MOD 0.12MM
|
Ti900 | Silicone | White | Rectangle | 0.0050" (0.127mm) | 104.10mm x 73.70mm | Viscose | - | 1.8 W/m-K |