- Thickness：
-
- Adhesive：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 4
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Color | Thickness | Usage | Adhesive | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Color | Thickness | Usage | Adhesive | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Bergquist |
8,773
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .015" SP2000
|
Sil-Pad 2000 | White | 0.0150" (0.381mm) | TO-220 | - | Fiberglass | 0.33°C/W | 3.5 W/m-K | ||
|
|
|
Bergquist |
9,585
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .009" SP600
|
Sil-Pad 600 | Green | 0.0090" (0.229mm) | TO-218，TO-220，TO-247 | - | - | 0.35°C/W | 1.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
2,284
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TGARD 210,A0 TO-220 0.010"
|
Tgard 200 | White | 0.0100" (0.254mm) | TO-220 | - | Fiberglass | - | 5.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SILPAD A2000 W/ADHESIVE
|
Sil-Pad A2000 | White | 0.0200" (0.508mm) | TO-220 | Adhesive - One Side | Fiberglass | 0.32°C/W | 3.0 W/m-K |
