- Series:
-
- Backing,Carrier:
-
- Thermal Resistivity:
-
- Electus conditionibus;
Odonata Lepidoptera products 2
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Thickness | Backing,Carrier | Thermal Resistivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Thickness | Backing,Carrier | Thermal Resistivity | ||
Bergquist |
7,528
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .006" K4
|
Sil-Pad K-4 | 0.0060" (0.152mm) | Polyimide | 0.48°C/W | ||||
Bergquist |
6,384
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .007" SP400
|
Sil-Pad 400 | 0.0070" (0.178mm) | Fiberglass | 1.13°C/W |