- Thickness：
-
- Adhesive：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 4
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Adhesive | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Adhesive | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Bergquist |
8,773
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .015" SP2000
|
Sil-Pad 2000 | Silicone Elastomer | 0.0150" (0.381mm) | - | Fiberglass | 0.33°C/W | 3.5 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
2,284
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
TGARD 210,A0 TO-220 0.010"
|
Tgard 200 | Silicone Elastomer | 0.0100" (0.254mm) | - | Fiberglass | - | 5.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SILPAD A2000 W/ADHESIVE
|
Sil-Pad A2000 | Silicone Elastomer | 0.0200" (0.508mm) | Adhesive - One Side | Fiberglass | 0.32°C/W | 3.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
KIT,TGARD 20,A1
|
Tgard 20 | Phase Change Compound | 0.0030" (0.076mm) | Adhesive - One Side | - | 3.40°C/W | - |
