- Material：
-
- Thickness：
-
- Adhesive：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Usage | Adhesive | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Usage | Adhesive | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Bergquist |
7,528
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .006" K4
|
Sil-Pad K-4 | Silicone Rubber | 0.0060" (0.152mm) | TO-218，TO-220，TO-247 | - | Polyimide | 0.48°C/W | 0.9 W/m-K | ||
|
|
|
Bergquist |
6,384
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .007" SP400
|
Sil-Pad 400 | Silicone Rubber | 0.0070" (0.178mm) | TO-218，TO-220，TO-247 | - | Fiberglass | 1.13°C/W | 0.9 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TGON 805,A0 TO-220 0.006"
|
Tgon 805 | Graphite | 0.0050" (0.127mm) | TO-220 | - | - | 0.07°C/W | 5.0 W/m-K | ||
|
|
|
Wakefield-Vette |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD .006" GRAY
|
175 | - | 0.0060" (0.152mm) | TO-220 | - | Polyimide | 0.40°C/W | 0.5 W/m-K | ||
|
|
Laird Technologies - Thermal Materials |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
KIT,TPCM AL52,2,0505,A1
|
Tpcm AL-52 | Aluminum | 0.0030" (0.076mm) | TO-220 | Adhesive - One Side | Phase Change Compound | - | - |
