Odonata Lepidoptera products 5
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Material Color Thickness Backing,Carrier Thermal Resistivity Thermal Conductivity
SP400-0.009-00-03
Bergquist
1,670
III dies
-
MOQ: 1  MPQ: 1
THERMAL PAD TO-3 .009" SP400
Sil-Pad 400 Silicone Rubber Gray 0.0090" (0.229mm) Fiberglass 1.40°C/W 0.9 W/m-K
DC0003/02-H48-2K-0.1
t-Global Technology
197
III dies
-
MOQ: 1  MPQ: 1
THERMAL H48-2K TO-3 4LEAD 0.1MM
H48-2K Silicone Red 0.0039" (0.100mm) - - 1.8 W/m-K
DC0001/01-H48-2K-0.1
t-Global Technology
32
III dies
-
MOQ: 1  MPQ: 1
THERMAL PAD H48-2K TO-3 0.1MM
H48-2K Silicone Red 0.0039" (0.100mm) - - 1.8 W/m-K
4103G
Aavid,Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
ALUMINUM OXIDE INSULATOR
- Aluminum Oxide Ceramic - 0.0750" (1.905mm) - - -
53-03-14
Aavid,Thermal Division of Boyd Corporation
Quaestiones
-
-
MOQ: 1  MPQ: 1
THERMAL INTERFACE PAD
ThermalsilIII Silicone Rubber Gray,Green 0.0060" (0.152mm) - - 0.9 W/m-K