- Series：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 2
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Usage | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Usage | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
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Essentra Components |
Quaestiones
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- |
-
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MOQ: 1 MPQ: 1
|
TRANSISTOR INSUL PAD 1.41X.81"
|
TO-2xx | Silicone Rubber and Fiberglass Composite | 0.0070" (0.178mm) | - | - | - | - | ||
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|
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Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD .006" K4 CUSTOM
|
Sil-Pad K-4 | Silicone Rubber | 0.0060" (0.152mm) | Multi | Polyimide | 0.48°C/W | 0.9 W/m-K |
