- Series：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Electus conditionibus;
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Material | Thickness | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Bergquist |
1,297
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .006"
|
Q-Pad II | Sil-Pad Rubber，Aluminum Coated | 0.0060" (0.152mm) | 19.05mm x 12.70mm | - | 0.22°C/W | 2.5 W/m-K | ||
|
|
|
Bergquist |
2,739
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .005" Q3
|
Q-Pad 3 | Elastomer | 0.0050" (0.127mm) | 19.05mm x 12.70mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .005" Q3
|
Q-Pad 3 | Elastomer | 0.0050" (0.127mm) | 17.45mm x 14.27mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
2,506
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
THERM PAD TO-220 CLIP .005" Q3
|
Q-Pad 3 | Elastomer | 0.0050" (0.127mm) | 19.05mm x 12.70mm | Fiberglass | 0.35°C/W | 2.0 W/m-K | ||
|
|
|
Bergquist |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD TO-220 .005" Q3
|
Q-Pad 3 | Elastomer | 0.0050" (0.127mm) | 19.05mm x 12.70mm | Fiberglass | 0.35°C/W | 2.0 W/m-K |
