- Voltage - Supply：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Ratio - Input:Output：
-
- Frequency - Max：
-
Odonata Lepidoptera products 41
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Output | Number of Circuits | Ratio - Input:Output | Frequency - Max | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Output | Number of Circuits | Ratio - Input:Output | Frequency - Max | |
|
|
|
Silicon Labs |
485
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:6 40-QFN
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-QFN (5x5) | HCSL | 1 | 0.04583333333333334 | 133.33MHz | ||
|
|
|
Silicon Labs |
268
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:8 48-QFN
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (6x6) | HCSL | 1 | 0.04722222222222222 | 133.33MHz | ||
|
|
|
Silicon Labs |
352
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:12 64-QFN
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 64-QFN (9x9) | HCSL | 1 | 0.05 | 133.33MHz | ||
|
|
|
Silicon Labs |
259
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:19 72-QFN
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 72-VFQFN Exposed Pad | 72-QFN (10x10) | HCSL | 1 | 0.05486111111111111 | 133.33MHz | ||
|
|
|
Silicon Labs |
197
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:19 72QFN
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 72-VFQFN Exposed Pad | 72-QFN (10x10) | HCSL | 1 | 0.05486111111111111 | 133.33MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
196
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER PCIE Z 72VFQFPN
|
3.135 V ~ 3.465 V | 0°C ~ 70°C | 72-VFQFN Exposed Pad | 72-VFQFPN (10x10) | HCSL | 1 | 0.05486111111111111 | 400MHz | ||
|
|
|
Silicon Labs |
214
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:15 64-QFN
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-WFQFN Exposed Pad | 64-QFN (9x9) | HCSL | 1 | 0.05208333333333334 | 133.33MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
606
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB600ZL OEM DERIVATIVE "LITE"
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) | HCSL | 1 | 0.04583333333333334 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
339
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB600ZL OEM DERIVATIVE
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) | HCSL | 1 | 0.04583333333333334 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB600ZL OEM DERIVATIVE + WRTLK
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) | HCSL | 1 | 0.04583333333333334 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB600ZL OEM DERIV "LITE" + WRTLK
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) | HCSL | 1 | 0.04583333333333334 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
442
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB800ZL "LITE"
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | HCSL | 1 | 0.04722222222222222 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
238
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB800ZL
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | HCSL | 1 | 0.04722222222222222 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB800ZL OEM DERIVATIVE + WRTLK
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | HCSL | 1 | 0.04722222222222222 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB800ZL "LITE" OEM DERIV + WRTLK
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | HCSL | 1 | 0.04722222222222222 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB800ZL 105C
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | HCSL | 1 | 0.04722222222222222 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
490
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB800ZL "LITE" 105C
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | HCSL | 1 | 0.04722222222222222 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
202
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB1500ZL OEM DERIV
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | HCSL | 1 | 0.05208333333333334 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
515
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB1900ZL OEM DERIV "LITE" 6X6 MM
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 80-VFQFN Dual Rows，Exposed Pad | 80-GQFN (6x6) | HCSL | 1 | 0.05486111111111111 | 400MHz | ||
|
|
|
IDT，Integrated Device Technology Inc |
191
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
DB1500ZL OEM DERIV "LITE"
|
3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | HCSL | 1 | 0.05208333333333334 | 400MHz |
