- Packaging:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Main Purpose:
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- Output:
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- Ratio - Input:Output:
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- Differential - Input:Output:
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- Frequency - Max:
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- Mounting Type:
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- Electus conditionibus;
Odonata Lepidoptera products 663
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | PLL | Main Purpose | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | PLL | Main Purpose | Output | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | ||
Silicon Labs |
3,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
IC CLK BUFFER PCIE 1:2 8TDFN
|
Tape & Reel (TR) | - | 2.25 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN Exposed Pad | 8-TDFN (1.4x1.6) | No | PCI Express (PCIe) | Clock | 1 | 0.04305555555555556 | Yes/Yes | 100MHz | Surface Mount | ||||
Silicon Labs |
8,305
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER PCIE 1:2 8TDFN
|
Cut Tape (CT) | - | 2.25 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN Exposed Pad | 8-TDFN (1.4x1.6) | No | PCI Express (PCIe) | Clock | 1 | 0.04305555555555556 | Yes/Yes | 100MHz | Surface Mount | ||||
Silicon Labs |
8,305
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER PCIE 1:2 8TDFN
|
- | - | 2.25 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN Exposed Pad | 8-TDFN (1.4x1.6) | No | PCI Express (PCIe) | Clock | 1 | 0.04305555555555556 | Yes/Yes | 100MHz | Surface Mount | ||||
Silicon Labs |
744
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TIMING CLOCK 36QFN
|
Tray | - | 2.25 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet | CML,CMOS,LVDS,LVPECL | 1 | 0.08472222222222221 | Yes/Yes | 346MHz | Surface Mount | ||||
Silicon Labs |
813
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLOCK MULT 2KHZ-150MHZ 36VQFN
|
Tray | DSPLL | 1.71 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet (WAN),SONET/SDH/STM,Video | CML,CMOS,LVDS,LVPECL | 1 | 0.08472222222222221 | Yes/Yes | 150MHz | Surface Mount | ||||
Silicon Labs |
1,142
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLOCK MULT 2KHZ-346MHZ 36VQFN
|
Tray | DSPLL | 1.71 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet (WAN),SONET/SDH/STM,Video | CML,CMOS,LVDS,LVPECL | 1 | 0.08472222222222221 | Yes/Yes | 346MHz | Surface Mount | ||||
Silicon Labs |
887
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLOCK MULT 2KHZ-808MHZ 36VQFN
|
Tray | DSPLL | 1.71 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet (WAN),SONET/SDH/STM,Video | CML,CMOS,LVDS,LVPECL | 1 | 0.08472222222222221 | Yes/Yes | 808MHz | Surface Mount | ||||
Silicon Labs |
725
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER PCIE 1:2 8TDFN
|
Strip | - | 2.25 V ~ 3.63 V | -40°C ~ 85°C | 8-WFDFN Exposed Pad | 8-TDFN (1.4x1.6) | No | PCI Express (PCIe) | Clock | 1 | 0.04305555555555556 | Yes/Yes | 100MHz | Surface Mount | ||||
Silicon Labs |
485
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:6 40-QFN
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-QFN (5x5) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.04583333333333334 | Yes/Yes | 133.33MHz | Surface Mount | ||||
Silicon Labs |
268
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:8 48-QFN
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (6x6) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.04722222222222222 | Yes/Yes | 133.33MHz | Surface Mount | ||||
Silicon Labs |
352
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:12 64-QFN
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 64-QFN (9x9) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.05 | Yes/Yes | 133.33MHz | Surface Mount | ||||
Silicon Labs |
288
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CLK MULTIPLIER ETH 36QFN
|
Tray | - | 2.25 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet | CML,CMOS,LVDS,LVPECL | 1 | 0.08472222222222221 | Yes/Yes | 808MHz | Surface Mount | ||||
Silicon Labs |
259
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:19 72-QFN
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 72-VFQFN Exposed Pad | 72-QFN (10x10) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.05486111111111111 | Yes/Yes | 133.33MHz | Surface Mount | ||||
Silicon Labs |
197
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:19 72QFN
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 72-VFQFN Exposed Pad | 72-QFN (10x10) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.05486111111111111 | Yes/Yes | 133.33MHz | Surface Mount | ||||
NXP USA Inc. |
1,500
|
III dies |
-
|
MOQ: 1500 MPQ: 1
|
IC FREQUENCY GEN TX/TXRX 24HVQFN
|
Tape & Reel (TR) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | No | Ku band VSAT applications | Clock | 1 | 0.04444444444444445 | Yes/No | 13.05GHz | Surface Mount | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC FREQUENCY GEN TX/TXRX 24HVQFN
|
Tape & Reel (TR) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | No | Ku band VSAT applications | Clock | 1 | 0.04444444444444445 | Yes/No | 13.05GHz | Surface Mount | ||||
NXP USA Inc. |
2,258
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FREQUENCY GEN TX/TXRX 24HVQFN
|
Cut Tape (CT) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | No | Ku band VSAT applications | Clock | 1 | 0.04444444444444445 | Yes/No | 13.05GHz | Surface Mount | ||||
NXP USA Inc. |
2,258
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FREQUENCY GEN TX/TXRX 24HVQFN
|
- | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | No | Ku band VSAT applications | Clock | 1 | 0.04444444444444445 | Yes/No | 13.05GHz | Surface Mount | ||||
IDT,Integrated Device Technology Inc |
196
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER PCIE Z 72VFQFPN
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 72-VFQFN Exposed Pad | 72-VFQFPN (10x10) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.05486111111111111 | Yes/Yes | 400MHz | Surface Mount | ||||
Silicon Labs |
214
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER ZDB PCIE 1:15 64-QFN
|
Tray | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 64-WFQFN Exposed Pad | 64-QFN (9x9) | Yes | Intel QPI,PCI Express (PCIe) | HCSL | 1 | 0.05208333333333334 | Yes/Yes | 133.33MHz | Surface Mount |