Odonata Lepidoptera products 114
Image part manufacturer quantitas partus tempus Unit Price buy Description Operating Temperature Package / Case Supplier Device Package Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
EP4CE15F17I8LN
Intel
281
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 165 I/O 256FBGA
-40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 165 963 15408 516096
EP4CE10E22I8LN
Intel
165
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 91 I/O 144EQFP
-40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 645 10320 423936
EP4CE15E22I8LN
Intel
101
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 81 I/O 144EQFP
-40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 81 963 15408 516096
EP4CE15F23I8LN
Intel
111
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 343 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 343 963 15408 516096
EP4CE40F29I8LN
Intel
34
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 532 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BGA 780-FBGA (29x29) 532 2475 39600 1161216
EP4CE22F17I8LN
Intel
76
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256FBGA
-40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 153 1395 22320 608256
EP4CE75F23I8LN
Intel
57
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 292 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 292 4713 75408 2810880
EP4CE6F17I8LN
Intel
54
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256FBGA
-40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 179 392 6272 276480
EP4CE6E22I8LN
Intel
21
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 91 I/O 144EQFP
-40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 392 6272 276480
EP4CE10F17I8LN
Intel
90
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256FBGA
-40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 179 645 10320 423936
EP4CE22E22I8LN
Intel
79
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 79 I/O 144EQFP
-40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 79 1395 22320 608256
EP4CE55F23I8LN
Intel
17
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 324 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 324 3491 55856 2396160
EP4CE30F23I8LN
Intel
13
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848 608256
EP4CE30F29I8LN
Intel
432
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 532 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BGA 780-FBGA (29x29) 532 1803 28848 608256
EP4CE6E22C9LN
Intel
Quaestiones
-
-
MOQ: 120  MPQ: 1
IC FPGA 91 I/O 144EQFP
0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 392 6272 276480
EP4CE6E22C9L
Intel
Quaestiones
-
-
MOQ: 120  MPQ: 1
IC FPGA 91 I/O 144EQFP
0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 392 6272 276480
EP4CE6F17C9LN
Intel
Quaestiones
-
-
MOQ: 90  MPQ: 1
IC FPGA 179 I/O 256FBGA
0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 179 392 6272 276480
EP4CE6E22C8LN
Intel
Quaestiones
-
-
MOQ: 120  MPQ: 1
IC FPGA 91 I/O 144EQFP
0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 392 6272 276480
EP4CE6E22C8L
Intel
Quaestiones
-
-
MOQ: 120  MPQ: 1
IC FPGA 91 I/O 144EQFP
0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 392 6272 276480
EP4CE6F17C9L
Intel
Quaestiones
-
-
MOQ: 90  MPQ: 1
IC FPGA 179 I/O 256FBGA
0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 179 392 6272 276480