manufacturer:
Odonata Lepidoptera products 455
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Operating Temperature Package / Case Supplier Device Package Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
EP4CE75F23I8LN
Intel
57
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 292 I/O 484FBGA
Cyclone IV E -40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 292 4713 75408 2810880
XC7K160T-1FBG484C
Xilinx Inc.
20
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 285 I/O 484FCBGA
Kintex-7 0°C ~ 85°C (TJ) 484-BBGA,FCBGA 484-FCBGA (23x23) 285 12675 162240 11980800
XC7K160T-3FBG676E
Xilinx Inc.
10
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 400 I/O 676FCBGA
Kintex-7 0°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 400 12675 162240 11980800
XC7K410T-1FBG676C
Xilinx Inc.
10
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 400 I/O 676FCBGA
Kintex-7 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 400 31775 406720 29306880
XC7K325T-2FFG900I
Xilinx Inc.
8
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 500 I/O 900FCBGA
Kintex-7 -40°C ~ 100°C (TJ) 900-BBGA,FCBGA 900-FCBGA (31x31) 500 25475 326080 16404480
EP4CE6F17I8LN
Intel
54
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256FBGA
Cyclone IV E -40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 179 392 6272 276480
XC7K325T-1FFG676I
Xilinx Inc.
25
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 400 I/O 676FCBGA
Kintex-7 -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 400 25475 326080 16404480
XC7K325T-2FFG676C
Xilinx Inc.
13
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 400 I/O 676FCBGA
Kintex-7 0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 400 25475 326080 16404480
XC7K325T-1FFG900I
Xilinx Inc.
13
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 500 I/O 900FCBGA
Kintex-7 -40°C ~ 100°C (TJ) 900-BBGA,FCBGA 900-FCBGA (31x31) 500 25475 326080 16404480
XC7K325T-2FFG676I
Xilinx Inc.
5
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 400 I/O 676FCBGA
Kintex-7 -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 400 25475 326080 16404480
XC7K410T-1FFG900C
Xilinx Inc.
3
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 500 I/O 900FCBGA
Kintex-7 0°C ~ 85°C (TJ) 900-BBGA,FCBGA 900-FCBGA (31x31) 500 31775 406720 29306880
EP4CE6E22I8LN
Intel
21
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 91 I/O 144EQFP
Cyclone IV E -40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 392 6272 276480
EP4CE10F17I8LN
Intel
90
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256FBGA
Cyclone IV E -40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 179 645 10320 423936
EP4CE22E22I8LN
Intel
79
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 79 I/O 144EQFP
Cyclone IV E -40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 79 1395 22320 608256
EP4CE55F23I8LN
Intel
17
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 324 I/O 484FBGA
Cyclone IV E -40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 324 3491 55856 2396160
XC7K325T-1FFG900C
Xilinx Inc.
19
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 500 I/O 900FCBGA
Kintex-7 0°C ~ 85°C (TJ) 900-BBGA,FCBGA 900-FCBGA (31x31) 500 25475 326080 16404480
XC7K355T-1FFG901C
Xilinx Inc.
4
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 300 I/O 901FCBGA
Kintex-7 0°C ~ 85°C (TJ) 900-BBGA,FCBGA 901-FCBGA (31x31) 300 27825 356160 26357760
EP4CE30F23I8LN
Intel
13
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
Cyclone IV E -40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848 608256
XC7K160T-1FBG676I
Xilinx Inc.
23
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 400 I/O 676FCBGA
Kintex-7 -40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 400 12675 162240 11980800
XC7K410T-2FFG900C
Xilinx Inc.
3
III dies
-
MOQ: 1  MPQ: 1
IC FPGA 500 I/O 900FCBGA
Kintex-7 0°C ~ 85°C (TJ) 900-BBGA,FCBGA 900-FCBGA (31x31) 500 31775 406720 29306880