- Voltage - Supply:
-
- Operating Temperature:
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- Package / Case:
-
- Supplier Device Package:
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Odonata Lepidoptera products 20
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Intel |
2,000
|
III dies |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
2,433
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
2,433
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
6,972
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | ||||
Intel |
7,670
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | ||||
Intel |
308
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | 112 | ||||
Intel |
337
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 160 | ||||
Intel |
3,211
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | ||||
Intel |
648
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
2.85 V ~ 3.465 V | -40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | ||||
Intel |
1,000
|
III dies |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
1,260
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
1,260
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
352
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 130 I/O 169UBGA
|
2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 169-LFBGA | 169-UBGA (11x11) | 130 | ||||
Intel |
175
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
2.85 V ~ 3.465 V | -40°C ~ 125°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 | ||||
Intel |
94
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
1.15 V ~ 1.25 V | -40°C ~ 100°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 160 | ||||
Intel |
50
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
324-PIN UBGA
|
2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 130 | ||||
Intel |
23
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 112 I/O 153MBGA
|
2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 153-VFBGA | 153-MBGA (8x8) | 112 | ||||
Intel |
Quaestiones
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC FPGA 27 I/O 36WLCSP
|
1.15 V ~ 1.25 V | 0°C ~ 85°C (TJ) | 36-UFBGA,WLCSP | 36-WLCSP (3x3) | 27 | ||||
Intel |
Quaestiones
|
- |
-
|
MOQ: 119 MPQ: 1
|
IC FPGA 160 I/O 324UBGA
|
1.15 V ~ 1.25 V | -40°C ~ 125°C (TJ) | 324-LFBGA | 324-UBGA (15x15) | 160 | ||||
Intel |
Quaestiones
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 101 I/O 144EQFP
|
2.85 V ~ 3.465 V | 0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 101 |