- Packaging：
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- Series：
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- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Program Memory Type：
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- Electus conditionibus;
Odonata Lepidoptera products 21
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | RAM Size | Program Memory Type | Controller Series | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | RAM Size | Program Memory Type | Controller Series | |
|
|
|
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
Tape & Reel (TR) | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
Cut Tape (CT) | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
- | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
Tape & Reel (TR) | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
Cut Tape (CT) | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
- | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
Tape & Reel (TR) | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
Cut Tape (CT) | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
3,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
- | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURE AUTHENTICATION
|
Tape & Reel (TR) | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
5,732
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
Cut Tape (CT) | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
5,732
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
- | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
Tape & Reel (TR) | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
5,999
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
Cut Tape (CT) | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
5,999
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
- | A71CH | I2C | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURE AUTHENTICATION
|
Tape & Reel (TR) | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
Cut Tape (CT) | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
- | A71CH | I2C | 2.5 V ~ 3.6 V | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | - | - | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2450 MPQ: 1
|
MCU SECURE ID 32-HVQFN
|
Tray | - | I2C，2-Wire Serial | 1.62 V ~ 5.5 V | -25°C ~ 85°C | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Surface Mount | 3.2kB | EEPROM (76.4 kB) | A700x | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2450 MPQ: 1
|
MCU SECURE ID
|
- | - | I2C，2-Wire Serial | 1.62 V ~ 5.5 V | -25°C ~ 85°C | - | - | - | 3.2kB | EEPROM (76.4 kB) | A700x |
