- Packaging：
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- Operating Temperature：
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- Core Processor：
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- Voltage - I/O：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Electus conditionibus;
Odonata Lepidoptera products 94
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
5,402
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -20°C ~ 70°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad | 10/100 Mbps (1) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
1,764
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
3,535
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Yes | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
|
NXP USA Inc. |
265
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Yes | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,252
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -20°C ~ 70°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
744
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -20°C ~ 70°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Yes | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
|
NXP USA Inc. |
155
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
120
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
171
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
617
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad | 10/100 Mbps (1) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
330
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure Fusebox，Secure JTAG，Secure Memory，Tamper Detection | ||
|
|
|
NXP USA Inc. |
145
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure Fusebox，Secure JTAG，Secure Memory，Tamper Detection | ||
|
|
|
NXP USA Inc. |
448
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -40°C ~ 85°C (TA) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | No | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure Fusebox，Secure JTAG，Secure Memory，Tamper Detection | ||
|
|
|
NXP USA Inc. |
450
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
189
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -20°C ~ 70°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Yes | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
|
NXP USA Inc. |
323
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; IPU，VFP | LPDDR，DDR2 | No | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG | ||
|
|
|
NXP USA Inc. |
268
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Yes | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG | ||
|
|
|
NXP USA Inc. |
450
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | Yes | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
89
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE |
