- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Speed:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- Ethernet:
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- USB:
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- Electus conditionibus;
Odonata Lepidoptera products 1,304
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
NXP USA Inc. |
2,652
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 400MHz | 1 Core,32-Bit | - | DDR2 | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
596
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 333MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
133
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 333MHz | 1 Core,32-Bit | Security; SEC 2.2 | DDR,DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography | ||||
NXP USA Inc. |
1,260
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 266MHz | 1 Core,32-Bit | - | DDR2 | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
420
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 400MHz | 1 Core,32-Bit | - | DDR2 | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 800MHZ 689TEBGA
|
Tray | MPC83XX | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 800MHz | 1 Core,32-Bit | Security; SEC 3.0 | DDR,DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
131
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 400MHz | 1 Core,32-Bit | Security; SEC 3.3 | DDR,DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
135
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 667MHZ 689TEBGA
|
Tray | MPC83XX | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 667MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
130
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 667MHZ 689TEBGA
|
Tray | MPC83XX | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 667MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
42
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.0GHz | 1 Core,32-Bit | Signal Processing; SPE,Security; SEC | DDR,DDR2,SDRAM | - | 10/100/1000 Mbps (4) | - | - | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
119
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 400MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 400MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
135
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 667MHZ 689TEBGA
|
Tray | MPC83XX | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 667MHz | 1 Core,32-Bit | Security; SEC 3.0 | DDR,DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
27
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 800MHZ 689TEBGA
|
Tray | MPC83XX | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 800MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
54
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 800MHZ 689TEBGA
|
Tray | MPC83XX | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 800MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
30
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 533MHZ 672TBGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 672-LBGA | 672-TBGA (35x35) | PowerPC e300 | 533MHz | 1 Core,32-Bit | - | DDR,DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 800MHZ 783FCBGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 800MHz | 1 Core,32-Bit | Signal Processing; SPE | DDR,DDR2,SDRAM | - | 10/100/1000 Mbps (4) | - | - | - | ||||
NXP USA Inc. |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
Tray | MPC85xx | -40°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.0GHz | 1 Core,32-Bit | Signal Processing; SPE,Security; SEC | DDR,DDR2,SDRAM | - | 10/100/1000 Mbps (4) | - | - | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
124
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.333GHZ 783BGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.333GHz | 1 Core,32-Bit | Signal Processing; SPE | DDR,DDR2,SDRAM | - | 10/100/1000 Mbps (4) | - | - | - | ||||
NXP USA Inc. |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.333GHZ 783BGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.333GHz | 1 Core,32-Bit | Signal Processing; SPE,Security; SEC | DDR,DDR2,SDRAM | - | 10/100/1000 Mbps (4) | - | - | Cryptography,Random Number Generator |