manufacturer:
RAM Controllers:
Display & Interface Controllers:
Ethernet:
Odonata Lepidoptera products 153
Image part manufacturer quantitas partus tempus Unit Price buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Core Processor Voltage - I/O Number of Cores/Bus Width Co-Processors/DSP RAM Controllers Display & Interface Controllers Ethernet
MC68360AI25L
NXP USA Inc.
72
III dies
-
MOQ: 1  MPQ: 1
IC MPU M683XX 25MHZ 240FQFP
Tray M683xx 0°C ~ 70°C (TA) 240-BFQFP 240-FQFP (32x32) CPU32+ 5.0V 1 Core,32-Bit Communications; CPM DRAM - 10 Mbps (1)
MC68EN360AI25L
NXP USA Inc.
65
III dies
-
MOQ: 1  MPQ: 1
IC MPU M683XX 25MHZ 240FQFP
Tray M683xx 0°C ~ 70°C (TA) 240-BFQFP 240-FQFP (32x32) CPU32+ 5.0V 1 Core,32-Bit Communications; CPM DRAM - 10 Mbps (1)
MC68302EH25C
NXP USA Inc.
221
III dies
-
MOQ: 1  MPQ: 1
IC MPU M683XX 25MHZ 132QFP
Tray M683xx 0°C ~ 70°C (TA) 132-BQFP Bumpered 132-PQFP (24.13x24.13) M68000 5.0V 1 Core,8/16-Bit Communications; RISC CPM DRAM - -
NS486SXF-25/NOPB
Texas Instruments
49
III dies
-
MOQ: 1  MPQ: 1
IC MPU INTEL486 SX 25MHZ 160QFP
Tray - 0°C ~ 70°C (TA) 160-BFQFP 160-PQFP (28x28) Intel486 SX 3.3V,5.0V 1 Core,32-Bit - DRAM LCD -
MC68360CAI25L
NXP USA Inc.
22
III dies
-
MOQ: 1  MPQ: 1
IC MPU M683XX 25MHZ 240FQFP
Tray M683xx -40°C ~ 85°C (TA) 240-BFQFP 240-FQFP (32x32) CPU32+ 5.0V 1 Core,32-Bit Communications; CPM DRAM - 10 Mbps (1)
NG80960JA3V25
Intel
14
III dies
-
MOQ: 1  MPQ: 1
IC MPU I960 25MHZ 132QFP
Tray i960 0°C ~ 100°C (TC) 132-QFP 132-QFP i960 3.3V 1 Core,32-Bit - - - -
GD80960JA25
Intel
18
III dies
-
MOQ: 1  MPQ: 1
IC MPU I960 25MHZ 196BGA
Tray i960 0°C ~ 100°C (TC) 196-BGA 196-BGA i960 3.3V 1 Core,32-Bit - - - -
TG80960JA3V25
Intel
15
III dies
-
MOQ: 1  MPQ: 1
IC MPU I960 25MHZ 132QFP
Tray i960 0°C ~ 100°C (TC) 132-QFP 132-QFP i960 3.3V 1 Core,32-Bit - - - -
NG80960JF3V25
Intel
20
III dies
-
MOQ: 1  MPQ: 1
IC MPU I960 25MHZ 132QFP
Tray i960 0°C ~ 100°C (TC) 132-QFP 132-QFP i960 3.3V 1 Core,32-Bit - - - -
NG80960JS25
Intel
20
III dies
-
MOQ: 1  MPQ: 1
IC MPU I960 25MHZ 132QFP
Tray i960 0°C ~ 100°C (TC) 132-BQFP Bumpered 132-QFP i960 3.3V 1 Core,32-Bit - - - -
NG80386SXLP25
Intel
9
III dies
-
MOQ: 1  MPQ: 1
IC MPU I386 25MHZ 100QFP
Tray i386 0°C ~ 100°C (TC) 100-QFP 100-PQFP (19x19) Intel386 SX 5.0V 1 Core,32-Bit Math Engine; Intel387 SX - - -
KU80386SXTA25
Intel
8
III dies
-
MOQ: 1  MPQ: 1
IC MPU I386 25MHZ 100QFP
Tray i386 0°C ~ 100°C (TC) 100-QFP 100-PQFP (19x19) Intel386 SX 5.0V 1 Core,32-Bit Math Engine; Intel387 SX - - -
TG80960JS25
Intel
2
III dies
-
MOQ: 1  MPQ: 1
IC MPU I960 25MHZ 132QFP
Tray i960 0°C ~ 100°C (TC) 132-QFP 132-QFP i960 3.3V 1 Core,32-Bit - - - -
A80C186ECI
Intel
1
III dies
-
MOQ: 1  MPQ: 1
IC MPU I186 25MHZ 132CPGA
Tray i186 -40°C ~ 85°C (TA) 132-CPGA 132-CPGA 80C186 5.0V 1 Core,16-Bit Math Engine; 80C187 DRAM - -
MC68LC302AF25CT
NXP USA Inc.
Quaestiones
-
-
MOQ: 90  MPQ: 1
IC MPU M683XX 25MHZ 100LQFP
Tray M683xx 0°C ~ 70°C (TA) 100-LQFP 100-LQFP (14x14) M68000 5.0V 1 Core,8/16-Bit Communications; RISC CPM DRAM - -
MC68340AG25E
NXP USA Inc.
Quaestiones
-
-
MOQ: 300  MPQ: 1
IC MPU M683XX 25MHZ 144LQFP
Tray M683xx 0°C ~ 70°C (TA) 144-LQFP 144-LQFP (20x20) CPU32 5.0V 1 Core,32-Bit - DRAM - -
MC68302AG25C
NXP USA Inc.
Quaestiones
-
-
MOQ: 60  MPQ: 1
IC MPU M683XX 25MHZ 144LQFP
Tray M683xx 0°C ~ 70°C (TA) 144-LQFP 144-LQFP (20x20) M68000 5.0V 1 Core,8/16-Bit Communications; RISC CPM DRAM - -
MC68340CAG25E
NXP USA Inc.
Quaestiones
-
-
MOQ: 300  MPQ: 1
IC MPU M683XX 25MHZ 144LQFP
Tray M683xx -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) CPU32 5.0V 1 Core,32-Bit - DRAM - -
MC68302EH25CR2
NXP USA Inc.
Quaestiones
-
-
MOQ: 190  MPQ: 1
IC MPU M683XX 25MHZ 132QFP
Tape & Reel (TR) M683xx 0°C ~ 70°C (TA) 132-BQFP Bumpered 132-PQFP (24.13x24.13) M68000 5.0V 1 Core,8/16-Bit Communications; RISC CPM DRAM - -
MC68302EH25CB1
NXP USA Inc.
Quaestiones
-
-
MOQ: 180  MPQ: 1
IC MPU M683XX 25MHZ 132QFP
Tray M683xx 0°C ~ 70°C (TA) 132-BQFP Bumpered 132-PQFP (24.13x24.13) M68000 5.0V 1 Core,8/16-Bit Communications; RISC CPM DRAM - -