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- Operating Temperature：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Electus conditionibus;
Odonata Lepidoptera products 563
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 800MHz | - | DDR3L，DDR4 | - | 2D-ACE | GbE (3) | SATA 6Gbps (1) | USB 3.0 (1) + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 1.0GHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | - | GbE (3) | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 800MHz | - | DDR3L，DDR4 | - | 2D-ACE | GbE (3) | SATA 6Gbps (1) | USB 3.0 (1) + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
64
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 1.0GHz | - | DDR3L，DDR4 | - | 2D-ACE | GbE (3) | SATA 6Gbps (1) | USB 3.0 (1) + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
68
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 1.0GHz | - | DDR3L，DDR4 | - | 2D-ACE | GbE (3) | SATA 6Gbps (1) | USB 3.0 (1) + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 1.2GHz | - | DDR3L，DDR4 | - | 2D-ACE | GbE (3) | SATA 6Gbps (1) | USB 3.0 (1) + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6 SERIES 64-BIT MPU DUAL A
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | - | 1.2GHz | - | DDR3 | - | - | GbE (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | - | 1.2GHz | - | DDR3 | - | - | GbE (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
85
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MDUAL 17X17 NO LID
|
Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | - | 1.3GHz | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | - | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA，FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | - | 1.2GHz | - | DDR3 | - | - | GbE (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1)，USB 3.0 + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 852MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.2GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
76
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSORS
|
Tray | Sitara | 0°C ~ 90°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | DSP，IPU，VPE | DDR3，SRAM | No | - | GbE | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
NXP USA Inc. |
34
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 852MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
57
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
30
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP ENHAN 624FCBGA
|
Tray | i.MX6DP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
Texas Instruments |
37
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | DSP，IPU，VPE | DDR3，SRAM | No | - | GbE | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP ENHAN 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
7
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP ENHAN 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS |
