- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- USB：
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- Security Features：
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- Electus conditionibus;
Odonata Lepidoptera products 563
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|
|
|
Texas Instruments |
43
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | DSP，IPU，VPE | DDR3，SRAM | No | - | GbE | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP ENHAN 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
50
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP ENHAN 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
50
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP ENHAN 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
54
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | QorIQ P1 | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 800MHz | Communications; QUICC Engine，Security; SEC 3.3 | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
24
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU E600 DUAL CORE 1023FCCBGA
|
Tray | MPC86xx | -40°C ~ 105°C (TA) | 1023-BCBGA，FCCBGA | 1023-FCCBGA (33x33) | PowerPC e600 | 1.8V，2.5V，3.3V | 1.067GHz | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | - | ||
|
|
|
NXP USA Inc. |
77
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
I.MX 7D 1.2 GHZ 19X19 MAPBGA
|
Tray | i.MX7D | 0°C ~ 85°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.2GHz | Multimedia; NEON® MPE | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
57
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 800MHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MDUAL 17X17 NO LID
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | - | 1.5GHz | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | - | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
27
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Tray | QorIQ P2 | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.2GHz | Security; SEC 3.3 | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
Renesas Electronics America |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOC - R-IN ASSP RZ/N1D 400-PIN
|
Tray | RZ/N1D | -40°C ~ 110°C (TJ) | 400-LFBGA | 400-BGA (17x17) | ARM® Cortex®-A7，ARM® Cortex®-M3 | 1.5V，1.8V，3.3V | 125MHz，500MHz | - | DDR2，DDR3 | - | - | 10/100/1000 Mbps | - | USB 2.0 (2) | - | ||
|
|
|
STMicroelectronics |
Quaestiones
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MPU SPEAR 333MHZ 420BGA
|
Tray | SPEAr | -40°C ~ 85°C (TC) | 420-FBGA | 420-PBGA | ARM926EJ-S | 3.3V | 333MHz | - | DDR，DDR2 | No | LCD，Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (3) | - | ||
|
|
|
NXP USA Inc. |
500
|
III dies |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 500MHz，167MHz | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，133MHz | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 1.0GHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | - | GbE (3) | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 + PHY | Secure Boot，TrustZone® | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
500
|
III dies |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6D 852MHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 852MHZ | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection |
