- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- RAM Controllers：
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- Ethernet：
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- Electus conditionibus;
Odonata Lepidoptera products 71
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | RAM Controllers | Ethernet | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | RAM Controllers | Ethernet | USB | |
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.2GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.6GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.2GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1043A R1.1 XTWE 1.6GHZ
|
Tray | -40°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.4GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.4GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | -40°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.2GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.6GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
57
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | -40°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.4GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1048A 1200/1600 ST WE
|
- | 0°C ~ 105°C | 780-BFBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.2GHz | DDR4 | 10 GbE (2)，1 GbE (8) | USB 3.0 (2) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PROTO: QORIQ LS 4XA72 64BIT ARM-
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.8GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | -40°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.8GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1048A 1400/1800 ST WE
|
- | 0°C ~ 105°C | 780-BFBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.4GHz | DDR4 | 10 GbE (2)，1 GbE (8) | USB 3.0 (2) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
LS1048A 1600/2100 ST WE
|
- | 0°C ~ 105°C | 780-BFBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.6GHz | DDR4 | 10 GbE (2)，1 GbE (8) | USB 3.0 (2) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.0GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | 0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.4GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | 0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.4GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | 0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.2GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | -40°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.2GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
Tray | 0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.6GHz | DDR3L，DDR4 | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
Tray | 0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A72 | 1.8GHz | DDR4 | 10 GbE (2)，2.5 GbE (1)，1 GbE (4) | USB 3.0 (3) + PHY |
