- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Number of Cores/Bus Width：
-
- Co-Processors/DSP：
-
- RAM Controllers：
-
- Electus conditionibus;
Odonata Lepidoptera products 115
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
192
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.067GHZ 689TBGA
|
Tray | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 1.067GHz | 2 Core，32-Bit | - | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
67
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 1.055GHz | 1 Core，32-Bit | Security; SEC | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
27
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.067GHZ 689TBGA
|
Tray | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 1.067GHz | 1 Core，32-Bit | - | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
32
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 1.055GHz | 2 Core，32-Bit | - | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | - | ||
|
|
|
NXP USA Inc. |
375
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
420
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
26
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 1.055GHz | 2 Core，32-Bit | Security; SEC | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 800MHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
61
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 1.055GHz | 2 Core，32-Bit | Security; SEC | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 800MHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
34
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 800MHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
Tray | -40°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 1.0GHz | 1 Core，32-Bit | Security; SEC 4.4 | DDR3，DDR3L | - | 10/100/1000 Mbps (3) | USB 2.0 + PHY (1) | Boot Security，Cryptography，Random Number Generator，Secure Fusebox | ||
|
|
|
NXP USA Inc. |
84
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | 800MHz | 1 Core，32-Bit | - | DDR3，DDR3L | - | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1) | - |
