- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Speed:
-
- Number of Cores/Bus Width:
-
- Ethernet:
-
- Security Features:
-
- Electus conditionibus;
Odonata Lepidoptera products 7
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | RAM Controllers | Ethernet | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | RAM Controllers | Ethernet | USB | Security Features | ||
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE 625BGA
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA,FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | 2 Core,32-Bit | DDR3 | GbE (3) | USB 2.0 + PHY (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA,FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | 2 Core,32-Bit | DDR3 | GbE (3) | USB 2.0 + PHY (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA,FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | 2 Core,32-Bit | DDR3 | GbE (3) | USB 2.0 + PHY (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA,FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | 2 Core,32-Bit | DDR3 | GbE (3) | USB 2.0 + PHY (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA,FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | 2 Core,32-Bit | DDR3 | GbE (3) | USB 2.0 + PHY (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
Tray | QorIQ Layerscape | 0°C ~ 70°C (TA) | 625-BFBGA,FCBGA | 625-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.2GHz | 2 Core,32-Bit | DDR3 | GbE (3) | USB 2.0 + PHY (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
Renesas Electronics America |
Quaestiones
|
- |
-
|
MOQ: 25 MPQ: 1
|
SOC RZ/G1H ROMLESS RAM 332K -40T
|
- | - | - | - | - | Quad ARM® Cortex®-A7,Quad ARM® Cortex®-A15 | - | - | - | - | USB 2.0 (2),USB 3.0 (1) | - |