manufacturer:
Odonata Lepidoptera products 7
Image part manufacturer quantitas partus tempus Unit Price buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Core Processor Speed Number of Cores/Bus Width RAM Controllers Ethernet USB Security Features
LS1024ASE7MLA
NXP USA Inc.
60
III dies
-
MOQ: 1  MPQ: 1
IC PROCESSOR DUAL CORE 625BGA
Tray QorIQ Layerscape 0°C ~ 70°C (TA) 625-BFBGA,FCBGA 625-FCPBGA (21x21) ARM® Cortex®-A9 1.2GHz 2 Core,32-Bit DDR3 GbE (3) USB 2.0 + PHY (1),USB 3.0 + PHY Secure Boot,TrustZone®
LS1024ASN7ELA
NXP USA Inc.
60
III dies
-
MOQ: 1  MPQ: 1
IC PROCESSOR DUAL CORE
Tray QorIQ Layerscape 0°C ~ 70°C (TA) 625-BFBGA,FCBGA 625-FCPBGA (21x21) ARM® Cortex®-A9 1.2GHz 2 Core,32-Bit DDR3 GbE (3) USB 2.0 + PHY (1),USB 3.0 + PHY Secure Boot,TrustZone®
LS1024ASN7JLA
NXP USA Inc.
60
III dies
-
MOQ: 1  MPQ: 1
IC PROCESSOR DUAL CORE
Tray QorIQ Layerscape 0°C ~ 70°C (TA) 625-BFBGA,FCBGA 625-FCPBGA (21x21) ARM® Cortex®-A9 1.2GHz 2 Core,32-Bit DDR3 GbE (3) USB 2.0 + PHY (1),USB 3.0 + PHY Secure Boot,TrustZone®
LS1024ASE7JLA
NXP USA Inc.
60
III dies
-
MOQ: 1  MPQ: 1
IC PROCESSOR DUAL CORE
Tray QorIQ Layerscape 0°C ~ 70°C (TA) 625-BFBGA,FCBGA 625-FCPBGA (21x21) ARM® Cortex®-A9 1.2GHz 2 Core,32-Bit DDR3 GbE (3) USB 2.0 + PHY (1),USB 3.0 + PHY Secure Boot,TrustZone®
LS1024ASN7MLA
NXP USA Inc.
60
III dies
-
MOQ: 1  MPQ: 1
IC PROCESSOR DUAL CORE
Tray QorIQ Layerscape 0°C ~ 70°C (TA) 625-BFBGA,FCBGA 625-FCPBGA (21x21) ARM® Cortex®-A9 1.2GHz 2 Core,32-Bit DDR3 GbE (3) USB 2.0 + PHY (1),USB 3.0 + PHY Secure Boot,TrustZone®
LS1024ASE7ELA
NXP USA Inc.
Quaestiones
-
-
MOQ: 60  MPQ: 1
IC PROCESSOR DUAL CORE
Tray QorIQ Layerscape 0°C ~ 70°C (TA) 625-BFBGA,FCBGA 625-FCPBGA (21x21) ARM® Cortex®-A9 1.2GHz 2 Core,32-Bit DDR3 GbE (3) USB 2.0 + PHY (1),USB 3.0 + PHY Secure Boot,TrustZone®
R8A77420HA02BG#UA
Renesas Electronics America
Quaestiones
-
-
MOQ: 25  MPQ: 1
SOC RZ/G1H ROMLESS RAM 332K -40T
- - - - - Quad ARM® Cortex®-A7,Quad ARM® Cortex®-A15 - - - - USB 2.0 (2),USB 3.0 (1) -