- Applications:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Multiplexer/Demultiplexer Circuit:
-
- On-State Resistance (Max):
-
- Voltage - Supply, Single (V+):
-
- Electus conditionibus;
Odonata Lepidoptera products 80
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Applications | Number of Channels | Operating Temperature | Package / Case | Supplier Device Package | Features | Multiplexer/Demultiplexer Circuit | Switch Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Applications | Number of Channels | Operating Temperature | Package / Case | Supplier Device Package | Features | Multiplexer/Demultiplexer Circuit | Switch Circuit | On-State Resistance (Max) | Voltage - Supply, Single (V+) | ||
ON Semiconductor |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
IC USB SWITCH DPDT 10UMLP
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UMLP (1.8x1.4) | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 2.4 V ~ 4.4 V | ||||
ON Semiconductor |
9,677
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10UMLP
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UMLP (1.8x1.4) | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 2.4 V ~ 4.4 V | ||||
ON Semiconductor |
9,677
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10UMLP
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UMLP (1.8x1.4) | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 2.4 V ~ 4.4 V | ||||
ON Semiconductor |
16,000
|
III dies |
-
|
MOQ: 4000 MPQ: 1
|
IC USB SWITCH DPDT 10MSOP
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 2.4 V ~ 4.4 V | ||||
ON Semiconductor |
17,951
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10MSOP
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 2.4 V ~ 4.4 V | ||||
ON Semiconductor |
17,951
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH DPDT 10MSOP
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 2.4 V ~ 4.4 V | ||||
ON Semiconductor |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
IC USB MUX/SWITCH 10MICROPAK
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak? | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
5,174
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB MUX/SWITCH 10MICROPAK
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak? | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
5,174
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB MUX/SWITCH 10MICROPAK
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak? | Break-Before-Make,USB 2.0 | - | DPDT | 6.5 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
IC USB SWITCH 2X2 10UMLP
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UMLP (1.8x1.4) | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
6,052
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH 2X2 10UMLP
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UMLP (1.8x1.4) | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
6,052
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH 2X2 10UMLP
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UMLP (1.8x1.4) | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
4,000
|
III dies |
-
|
MOQ: 4000 MPQ: 1
|
IC USB SWITCH 2X2 10MSOP
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
7,535
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH 2X2 10MSOP
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
7,535
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH 2X2 10MSOP
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
30,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
IC USB SWITCH 2X2 10MICROPAK
|
Tape & Reel (TR) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak? | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
37,878
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH 2X2 10MICROPAK
|
Cut Tape (CT) | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak? | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
37,878
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB SWITCH 2X2 10MICROPAK
|
- | USB | 1 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak? | Break-Before-Make,USB 2.0 | - | DPDT | 10 Ohm | 3 V ~ 4.3 V | ||||
ON Semiconductor |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC SWITCH MULTIMEDIA 10-UMLP
|
Tape & Reel (TR) | Audio,USB | 1 | -40°C ~ 85°C (TA) | 10-WFDFN Exposed Pad | 10-MLP (3x3) | USB 2.0 | - | DPDT | 2.7 Ohm (Audio),11 Ohm (USB) | 1.8 V ~ 4.3 V | ||||
ON Semiconductor |
128
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC SWITCH MULTIMEDIA 10-UMLP
|
Cut Tape (CT) | Audio,USB | 1 | -40°C ~ 85°C (TA) | 10-WFDFN Exposed Pad | 10-MLP (3x3) | USB 2.0 | - | DPDT | 2.7 Ohm (Audio),11 Ohm (USB) | 1.8 V ~ 4.3 V |