- manufacturer:
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- Packaging:
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- Interface:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Current - Supply:
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- Standards:
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- Electus conditionibus;
Odonata Lepidoptera products 998
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Current - Supply | Standards | Protocol | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Current - Supply | Standards | Protocol | ||
ON Semiconductor |
3,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
IC USB TYPE C CTLR PROGR 14MLP
|
Tape & Reel (TR) | USB | 2.8 V ~ 5.5 V | -40°C ~ 85°C | 14-WFQFN Exposed Pad | 14-MLP (2.5x2.5) | 25μA | USB 3.1 | USB | ||||
ON Semiconductor |
4,666
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB TYPE C CTLR PROGR 14MLP
|
Cut Tape (CT) | USB | 2.8 V ~ 5.5 V | -40°C ~ 85°C | 14-WFQFN Exposed Pad | 14-MLP (2.5x2.5) | 25μA | USB 3.1 | USB | ||||
ON Semiconductor |
4,666
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB TYPE C CTLR PROGR 14MLP
|
- | USB | 2.8 V ~ 5.5 V | -40°C ~ 85°C | 14-WFQFN Exposed Pad | 14-MLP (2.5x2.5) | 25μA | USB 3.1 | USB | ||||
Maxim Integrated |
6,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
IC I2C TO 1WIRE BRIDGE SOT23-6
|
Tape & Reel (TR) | I2C | 1.71 V ~ 5.25 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | 300μA | - | 1-Wire® | ||||
Maxim Integrated |
6,376
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I2C TO 1WIRE BRIDGE SOT23-6
|
Cut Tape (CT) | I2C | 1.71 V ~ 5.25 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | 300μA | - | 1-Wire® | ||||
Maxim Integrated |
6,376
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I2C TO 1WIRE BRIDGE SOT23-6
|
- | I2C | 1.71 V ~ 5.25 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | 300μA | - | 1-Wire® | ||||
Maxim Integrated |
9,000
|
III dies |
-
|
MOQ: 3000 MPQ: 1
|
IC MASTER I2C-1WIRE 1CH SOT-6
|
Tape & Reel (TR) | I2C | 1.71 V ~ 5.25 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | 300μA | - | 1-Wire® | ||||
Maxim Integrated |
12,052
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MASTER I2C-1WIRE 1CH SOT-6
|
Cut Tape (CT) | I2C | 1.71 V ~ 5.25 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | 300μA | - | 1-Wire® | ||||
Maxim Integrated |
12,052
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC MASTER I2C-1WIRE 1CH SOT-6
|
- | I2C | 1.71 V ~ 5.25 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | 300μA | - | 1-Wire® | ||||
Texas Instruments |
20,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC CTRLR POE PD IEEE 8SOPWRPAD
|
Tape & Reel (TR) | Parallel | 8 V ~ 12 V | - | 8-PowerSOIC (0.154",3.90mm Width) | 8-SO PowerPad | - | IEEE 802.3 | Ethernet | ||||
Texas Instruments |
20,227
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CTLR POE PD IEEE 8SOPWRPAD
|
Cut Tape (CT) | Parallel | 8 V ~ 12 V | - | 8-PowerSOIC (0.154",3.90mm Width) | 8-SO PowerPad | - | IEEE 802.3 | Ethernet | ||||
Texas Instruments |
20,227
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CTLR POE PD IEEE 8SOPWRPAD
|
- | Parallel | 8 V ~ 12 V | - | 8-PowerSOIC (0.154",3.90mm Width) | 8-SO PowerPad | - | IEEE 802.3 | Ethernet | ||||
FTDI,Future Technology Devices International Ltd |
27,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC CONTROLLER USB 28TSSOP
|
Tape & Reel (TR) | USB | 4 V ~ 5.5 V | -40°C ~ 85°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | 5mA | USB 2.0 | USB | ||||
FTDI,Future Technology Devices International Ltd |
28,890
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CONTROLLER USB 28TSSOP
|
Cut Tape (CT) | USB | 4 V ~ 5.5 V | -40°C ~ 85°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | 5mA | USB 2.0 | USB | ||||
FTDI,Future Technology Devices International Ltd |
28,890
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CONTROLLER USB 28TSSOP
|
- | USB | 4 V ~ 5.5 V | -40°C ~ 85°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | 5mA | USB 2.0 | USB | ||||
FTDI,Future Technology Devices International Ltd |
1,500
|
III dies |
-
|
MOQ: 1500 MPQ: 1
|
IC USB ANDROID HOST CTRL LQFP-32
|
Tape & Reel (TR) | UART | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-LQFP | 32-LQFP (7x7) | 25mA | USB 2.0 | USB | ||||
FTDI,Future Technology Devices International Ltd |
3,724
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB ANDROID HOST CTRL LQFP-32
|
Cut Tape (CT) | UART | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-LQFP | 32-LQFP (7x7) | 25mA | USB 2.0 | USB | ||||
FTDI,Future Technology Devices International Ltd |
3,724
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC USB ANDROID HOST CTRL LQFP-32
|
- | UART | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-LQFP | 32-LQFP (7x7) | 25mA | USB 2.0 | USB | ||||
WIZnet |
1,000
|
III dies |
-
|
MOQ: 2000 MPQ: 1
|
IC CONTROLLER ETHERNET 48QFN
|
Tape & Reel (TR) | SPI | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 5μA | 10/100 Base-T/TX PHY | Ethernet | ||||
WIZnet |
2,733
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC CONTROLLER ETHERNET 48QFN
|
Cut Tape (CT) | SPI | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-QFN (7x7) | 5μA | 10/100 Base-T/TX PHY | Ethernet |