- Packaging：
-
- Voltage - Supply：
-
- Operating Temperature：
-
- Standards：
-
- Electus conditionibus;
Odonata Lepidoptera products 35
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Current - Supply | Standards | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Current - Supply | Standards | |
|
|
|
FTDI，Future Technology Devices International Ltd |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC CONTROLLER USB 28QFN
|
Tape & Reel (TR) | USB | 4 V ~ 5.5 V | -40°C ~ 85°C | 5mA | USB 2.0 | ||
|
|
|
FTDI，Future Technology Devices International Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC CONTROLLER USB 28QFN
|
Cut Tape (CT) | USB | 4 V ~ 5.5 V | -40°C ~ 85°C | 5mA | USB 2.0 | ||
|
|
|
FTDI，Future Technology Devices International Ltd |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC CONTROLLER USB 28QFN
|
- | USB | 4 V ~ 5.5 V | -40°C ~ 85°C | 5mA | USB 2.0 | ||
|
|
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | SPI | - | - | - | USB 3.0 | |||
|
|
Microchip Technology |
4,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | SPI | - | - | - | USB 3.0 | |||
|
|
Microchip Technology |
4,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | SPI | - | - | - | USB 3.0 | |||
|
|
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | - | USB 3.0 | |||
|
|
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | - | USB 3.0 | |||
|
|
Microchip Technology |
910
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | - | USB 3.0 | |||
|
|
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | - | - | USB 3.0 | |||
|
|
Microchip Technology |
380
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | - | - | USB 3.0 |
