- Packaging:
-
- Voltage - Supply:
-
- Electus conditionibus;
Odonata Lepidoptera products 32
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | ||
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | SPI | - | ||||
Microchip Technology |
4,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | SPI | - | ||||
Microchip Technology |
4,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | SPI | - | ||||
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | ||||
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | ||||
Microchip Technology |
910
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | ||||
Microchip Technology |
980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
380
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tray | SPI | - | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Tape & Reel (TR) | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
Cut Tape (CT) | I2C | 1.8 V ~ 3.3 V | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HIGHLY INTEGRATED SMALL FORM FAC
|
- | I2C | 1.8 V ~ 3.3 V |