- Packaging:
-
- Package / Case:
-
- Supplier Device Package:
-
- Number of Drivers/Receivers:
-
Odonata Lepidoptera products 25
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Data Rate | Number of Drivers/Receivers | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Data Rate | Number of Drivers/Receivers | ||
NXP USA Inc. |
12,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-HVSON
|
Tape & Reel (TR) | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
16,082
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-HVSON
|
Cut Tape (CT) | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
16,082
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-HVSON
|
- | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
12,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8SOIC
|
Tape & Reel (TR) | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
13,227
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8SOIC
|
Cut Tape (CT) | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
13,227
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8SOIC
|
- | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-HVSON
|
Tape & Reel (TR) | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-HVSON
|
Cut Tape (CT) | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-HVSON
|
- | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC TRANSCEIVER LIN 8HVSON
|
Tape & Reel (TR) | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
5,554
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8HVSON
|
Cut Tape (CT) | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
5,554
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8HVSON
|
- | 8-VDFN Exposed Pad | 8-HVSON (3x3) | - | 43466 | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-SOIC
|
Tape & Reel (TR) | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
2,450
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-SOIC
|
Cut Tape (CT) | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
2,450
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 8-SOIC
|
- | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
Tape & Reel (TR) | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
2,367
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
Cut Tape (CT) | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
2,367
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TRANSCEIVER LIN 8SOIC
|
- | 8-SOIC (0.154",3.90mm Width) | 8-SO | - | 43466 | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TXRX LIN 2.2/SAE 14SOIC
|
Tape & Reel (TR) | 14-SOIC (0.154",3.90mm Width) | 14-SO | 20kBd | 43498 | ||||
NXP USA Inc. |
2,447
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC TXRX LIN 2.2/SAE 14SOIC
|
Cut Tape (CT) | 14-SOIC (0.154",3.90mm Width) | 14-SO | 20kBd | 43498 |