- Package / Case:
-
- Supplier Device Package:
-
- Mounting Type:
-
- Output Type:
-
- Electus conditionibus;
Odonata Lepidoptera products 42
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | ||
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tape & Reel (TR) | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Cut Tape (CT) | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
- | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
6,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tape & Reel (TR) | 20-SSOP (0.209",5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Cut Tape (CT) | 20-SSOP (0.209",5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
- | 20-SSOP (0.209",5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
6,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28SOIC
|
Tape & Reel (TR) | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | Surface Mount | POR | Push-Pull | 16 | ||||
Microchip Technology |
7,934
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28SOIC
|
Cut Tape (CT) | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | Surface Mount | POR | Push-Pull | 16 | ||||
Microchip Technology |
7,934
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28SOIC
|
- | 28-SOIC (0.295",7.50mm Width) | 28-SOIC | Surface Mount | POR | Push-Pull | 16 | ||||
Microchip Technology |
16,800
|
III dies |
-
|
MOQ: 2100 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28SSOP
|
Tape & Reel (TR) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | - | Push-Pull | 16 | ||||
Microchip Technology |
18,605
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28SSOP
|
Cut Tape (CT) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | - | Push-Pull | 16 | ||||
Microchip Technology |
18,605
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28SSOP
|
- | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | Surface Mount | - | Push-Pull | 16 | ||||
Microchip Technology |
1,638
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tube | 18-SOIC (0.295",7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
20,800
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28QFN
|
Tape & Reel (TR) | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | POR | Push-Pull | 16 | ||||
Microchip Technology |
21,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28QFN
|
Cut Tape (CT) | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | POR | Push-Pull | 16 | ||||
Microchip Technology |
21,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 28QFN
|
- | 28-VQFN Exposed Pad | 28-QFN (6x6) | Surface Mount | POR | Push-Pull | 16 | ||||
Microchip Technology |
11,002
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tray | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
4,891
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tube | 20-SSOP (0.209",5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | ||||
Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 16B 24QFN
|
Tape & Reel (TR) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount | - | Open Drain | 16 | ||||
Microchip Technology |
3,721
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 16B 24QFN
|
Cut Tape (CT) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Surface Mount | - | Open Drain | 16 |