- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Features：
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- Output Type：
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- Current - Output Source/Sink：
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- Electus conditionibus;
Odonata Lepidoptera products 136
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Interrupt Output | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Interrupt Output | Current - Output Source/Sink | |
|
|
|
NXP USA Inc. |
12,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
14,190
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
14,190
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
7,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,223
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,223
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | No | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | No | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | No | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
11,500
|
III dies |
-
|
MOQ: 500 MPQ: 1
|
IC EXPANDER 24B 32HUQFN
|
Tape & Reel (TR) | I2C | 1.65 V ~ 5.5 V | -40°C ~ 85°C | 32-UFQFN Exposed Pad | 32-HUQFN (5x5) | Surface Mount | POR | Open Drain，Push-Pull | 24 | Yes | - | ||
|
|
|
NXP USA Inc. |
11,646
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC EXPANDER 24B 32HUQFN
|
Cut Tape (CT) | I2C | 1.65 V ~ 5.5 V | -40°C ~ 85°C | 32-UFQFN Exposed Pad | 32-HUQFN (5x5) | Surface Mount | POR | Open Drain，Push-Pull | 24 | Yes | - | ||
|
|
|
NXP USA Inc. |
11,646
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC EXPANDER 24B 32HUQFN
|
- | I2C | 1.65 V ~ 5.5 V | -40°C ~ 85°C | 32-UFQFN Exposed Pad | 32-HUQFN (5x5) | Surface Mount | POR | Open Drain，Push-Pull | 24 | Yes | - | ||
|
|
|
NXP USA Inc. |
4,000
|
III dies |
-
|
MOQ: 2000 MPQ: 1
|
IC I/O EXPANDER I2C 40B 56HVQFN
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | Surface Mount | POR | Open Drain | 40 | Yes | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
4,532
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 40B 56HVQFN
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | Surface Mount | POR | Open Drain | 40 | Yes | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
4,532
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 40B 56HVQFN
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) | Surface Mount | POR | Open Drain | 40 | Yes | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
3,986
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 40B 56TSSOP
|
Tube | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 56-TFSOP (0.240"，6.10mm Width) | 56-TSSOP | Surface Mount | POR | Open Drain | 40 | Yes | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,801
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,801
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
5,000
|
III dies |
-
|
MOQ: 5000 MPQ: 1
|
ULTRA LOW-VOLTAGE TRANSLATING 24
|
Tape & Reel (TR) | I2C | 1.65 V ~ 5.5 V | -40°C ~ 85°C | 36-VFBGA | 36-VFBGA (2.6x2.6) | Surface Mount | POR | Open Drain，Push-Pull | 24 | Yes | - |
