- Voltage - Supply:
-
- Package / Case:
-
- Supplier Device Package:
-
- Output Type:
-
- Current - Output Source/Sink:
-
- Electus conditionibus;
Odonata Lepidoptera products 7
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Voltage - Supply | Package / Case | Supplier Device Package | Output Type | Interrupt Output | Current - Output Source/Sink | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Voltage - Supply | Package / Case | Supplier Device Package | Output Type | Interrupt Output | Current - Output Source/Sink | ||
Silicon Labs |
1,279
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 8B 20QFN
|
Tube | 3 V ~ 3.6 V | 20-VFQFN Exposed Pad | 20-QFN (4x4) | Open Drain,Push-Pull | Yes | 10mA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Push-Pull | No | - | ||||
NXP USA Inc. |
1,054
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Push-Pull | No | - | ||||
NXP USA Inc. |
1,054
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
- | 2.3 V ~ 3.6 V | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Push-Pull | No | - | ||||
Silicon Labs |
Quaestiones
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 8B 20QFN
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 20-VFQFN Exposed Pad | 20-QFN (4x4) | Open Drain,Push-Pull | Yes | 100mA | ||||
NXP USA Inc. |
13
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
Tray | 2.3 V ~ 3.6 V | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Push-Pull | No | - | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2450 MPQ: 1
|
IC I/O EXPANDER I2C/SPI 24HVQFN
|
Tray | 2.3 V ~ 3.6 V | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Push-Pull | No | - |