- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Output Type：
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- Clock Frequency：
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- Current - Output Source/Sink：
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- Electus conditionibus;
Odonata Lepidoptera products 33
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | Interrupt Output | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | Interrupt Output | Current - Output Source/Sink | |
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Semtech Corporation |
Quaestiones
|
- |
-
|
MOQ: 15000 MPQ: 1
|
IC GPIO EXPANDER I2C 8CH 20QFN
|
Tape & Reel (TR) | 1.425 V ~ 3.6 V | -40°C ~ 85°C | 20-UFQFN Exposed Pad | 20-QFN-UT (3x3) | Surface Mount | - | Open Drain，Push-Pull | 20MHz | No | 8mA，15mA | ||
|
|
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
- | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
6,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
- | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
1,638
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tube | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
11,002
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tray | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
4,891
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tube | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
17,410
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Tube | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
1,788
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18DIP
|
Tube | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-DIP (0.300"，7.62mm) | 18-PDIP | Through Hole | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
6,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
6,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
- | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
1,100
|
III dies |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
2,170
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
2,170
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
- | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | - | Open Drain | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA | |||
|
|
Microchip Technology |
1,719
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 10MHz | Yes | 25mA |
