- Package / Case：
-
- Supplier Device Package：
-
- Mounting Type：
-
- Output Type：
-
- Clock Frequency：
-
- Electus conditionibus;
Odonata Lepidoptera products 43
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | |
|
Microchip Technology |
4,400
|
III dies |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Tape & Reel (TR) | I2C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
5,186
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Cut Tape (CT) | I2C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
5,186
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
- | I2C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Tape & Reel (TR) | I2C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
5,315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Cut Tape (CT) | I2C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
5,315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
- | I2C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tape & Reel (TR) | SPI | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Cut Tape (CT) | SPI | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
- | SPI | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
6,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tape & Reel (TR) | SPI | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Cut Tape (CT) | SPI | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
- | SPI | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
1,538
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Tube | I2C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
1,638
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tube | SPI | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
8,640
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Tray | I2C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
3,693
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20SSOP
|
Tube | I2C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 1.7MHz | |||
|
|
Microchip Technology |
11,002
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tray | SPI | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
4,891
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tube | SPI | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | |||
|
|
Microchip Technology |
13,947
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QFN
|
Tube | I2C | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | POR | Open Drain | 3.4MHz | |||
|
|
Microchip Technology |
17,410
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Tube | SPI | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | 10MHz |
