- Series：
-
- Voltage - Supply：
-
- Package / Case：
-
- Supplier Device Package：
-
- Mounting Type：
-
- Output Type：
-
- Electus conditionibus;
Odonata Lepidoptera products 24
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | |
|
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
- | - | SPI | 1.8 V ~ 5.5 V | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
6,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
- | - | SPI | 1.8 V ~ 5.5 V | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
1,638
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tube | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
11,002
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tray | - | SPI | 1.8 V ~ 5.5 V | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
4,891
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tube | - | SPI | 1.8 V ~ 5.5 V | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
17,410
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Tube | - | SPI | 1.8 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
1,788
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18DIP
|
Tube | - | SPI | 1.8 V ~ 5.5 V | 18-DIP (0.300"，7.62mm) | 18-PDIP | Through Hole | POR | Push-Pull | |||
|
|
Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
6,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
6,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 16QFN
|
- | - | SPI | 1.8 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-QFN-EP (3x3) | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
1,100
|
III dies |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
2,170
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
2,170
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
- | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | - | Open Drain | |||
|
|
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
1,719
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | |||
|
|
Microchip Technology |
1,719
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
- | - | SPI | 1.8 V ~ 5.5 V | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull |
