- Interface：
-
- Voltage - Supply：
-
- Package / Case：
-
- Supplier Device Package：
-
- Mounting Type：
-
- Output Type：
-
- Current - Output Source/Sink：
-
- Electus conditionibus;
Odonata Lepidoptera products 61
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Interrupt Output | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Interrupt Output | Current - Output Source/Sink | |
|
|
|
NXP USA Inc. |
12,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
14,190
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
14,190
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
7,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,223
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,223
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
Diodes Incorporated |
Quaestiones
|
- |
-
|
MOQ: 3000 MPQ: 1
|
INTERFACE IO EXPANDER U-QFN2618-
|
Tape & Reel (TR) | I2C | 1.65 V ~ 3.6 V | 16-UFQFN | 16-UQFN (1.8x2.6) | Surface Mount | - | Push-Pull | Yes | - | ||
|
|
|
Diodes Incorporated |
1,846
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
INTERFACE IO EXPANDER U-QFN2618-
|
Cut Tape (CT) | I2C | 1.65 V ~ 3.6 V | 16-UFQFN | 16-UQFN (1.8x2.6) | Surface Mount | - | Push-Pull | Yes | - | ||
|
|
|
Diodes Incorporated |
1,846
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
INTERFACE IO EXPANDER U-QFN2618-
|
- | I2C | 1.65 V ~ 3.6 V | 16-UFQFN | 16-UQFN (1.8x2.6) | Surface Mount | - | Push-Pull | Yes | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Tape & Reel (TR) | I2C | 1.1 V ~ 3.6 V | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | No | - | ||
|
|
|
NXP USA Inc. |
2,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Cut Tape (CT) | I2C | 1.1 V ~ 3.6 V | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | No | - | ||
|
|
|
NXP USA Inc. |
2,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
- | I2C | 1.1 V ~ 3.6 V | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | No | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,512
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,512
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | No | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | No | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | No | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER 8BIT 16-HVQFN
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,596
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 8BIT 16-HVQFN
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | Yes | 100μA，25mA |
