- Series：
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- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Output Type：
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- Clock Frequency：
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- Electus conditionibus;
Odonata Lepidoptera products 69
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | Interrupt Output | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | Interrupt Output | |
|
|
|
Maxim Integrated |
311
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tube | - | I2C | 2.5 V ~ 5.5 V | -40°C ~ 125°C | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | POR | Open Drain | 100kHz | Yes | ||
|
|
|
Maxim Integrated |
203
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tube | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | No | ||
|
|
|
Maxim Integrated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tape & Reel (TR) | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | No | ||
|
|
|
Maxim Integrated |
422
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Cut Tape (CT) | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | No | ||
|
|
|
Maxim Integrated |
422
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
- | - | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | No | ||
|
|
|
Maxim Integrated |
Quaestiones
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tape & Reel (TR) | - | I2C | 2.5 V ~ 5.5 V | -40°C ~ 125°C | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | POR | Open Drain | 100kHz | Yes | ||
|
|
Microchip Technology |
4,400
|
III dies |
-
|
MOQ: 1100 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Tape & Reel (TR) | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
5,186
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Cut Tape (CT) | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
5,186
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
- | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Tape & Reel (TR) | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
5,315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
Cut Tape (CT) | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
5,315
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20QFN
|
- | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | |||
|
|
Microchip Technology |
9,404
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20QFN
|
- | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-VFQFN Exposed Pad | 20-QFN-EP (4x4) | Surface Mount | POR | Push-Pull | 10MHz | Yes | |||
|
|
Microchip Technology |
6,400
|
III dies |
-
|
MOQ: 1600 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Tape & Reel (TR) | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
Cut Tape (CT) | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | |||
|
|
Microchip Technology |
7,086
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 20SSOP
|
- | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 20-SSOP (0.209"，5.30mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 10MHz | Yes | |||
|
|
Microchip Technology |
1,538
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 18SOIC
|
Tube | - | I2C | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 1.7MHz | Yes | |||
|
|
Microchip Technology |
1,638
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER SPI 8B 18SOIC
|
Tube | - | SPI | 1.8 V ~ 5.5 V | -40°C ~ 125°C | 18-SOIC (0.295"，7.50mm Width) | 18-SOIC | Surface Mount | POR | Push-Pull | 10MHz | Yes |
