- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Output Type：
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- Current - Output Source/Sink：
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- Electus conditionibus;
Odonata Lepidoptera products 142
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Interrupt Output | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Interrupt Output | Current - Output Source/Sink | |
|
|
|
NXP USA Inc. |
20,314
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Cut Tape (CT) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
20,314
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
- | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
10,000
|
III dies |
-
|
MOQ: 1000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tape & Reel (TR) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
10,196
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Cut Tape (CT) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
10,196
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
- | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
Texas Instruments |
6,122
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16DIP
|
Tube | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-DIP (0.300"，7.62mm) | 16-PDIP | Through Hole | POR | Push-Pull | 8 | Yes | 1mA，25mA | ||
|
|
|
Texas Instruments |
4,407
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tube | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | POR | Push-Pull | 8 | Yes | 1mA，25mA | ||
|
|
|
Maxim Integrated |
470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tube | 2-Wire | 2.5 V ~ 5.5 V | -40°C ~ 125°C | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | - | Open Drain | 8 | No | - | ||
|
|
|
NXP USA Inc. |
4,000
|
III dies |
-
|
MOQ: 4000 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
Tape & Reel (TR) | I2C，SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | Surface Mount | POR | Push-Pull | 4 | No | 4mA | ||
|
|
|
NXP USA Inc. |
7,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
Cut Tape (CT) | I2C，SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | Surface Mount | POR | Push-Pull | 4 | No | 4mA | ||
|
|
|
NXP USA Inc. |
7,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
- | I2C，SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | Surface Mount | POR | Push-Pull | 4 | No | 4mA | ||
|
|
|
NXP USA Inc. |
10,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20SSOP
|
Tape & Reel (TR) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-LSSOP (0.173"，4.40mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
12,107
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20SSOP
|
Cut Tape (CT) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-LSSOP (0.173"，4.40mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
12,107
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20SSOP
|
- | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-LSSOP (0.173"，4.40mm Width) | 20-SSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
NXP USA Inc. |
3,225
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tube | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | Surface Mount | POR | Push-Pull | 8 | Yes | 300μA，25mA | ||
|
|
|
Maxim Integrated |
311
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tube | I2C | 2.5 V ~ 5.5 V | -40°C ~ 125°C | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | POR | Open Drain | 8 | Yes | 25mA | ||
|
|
|
Texas Instruments |
1,208
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20TSSOP
|
Tube | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 1mA，25mA | ||
|
|
|
Texas Instruments |
Quaestiones
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20VQFN
|
Tape & Reel (TR) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-VFQFN Exposed Pad | 20-VQFN (3.5x4.5) | Surface Mount | POR | Push-Pull | 8 | Yes | 1mA，25mA | ||
|
|
|
Texas Instruments |
2,830
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20VQFN
|
Cut Tape (CT) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-VFQFN Exposed Pad | 20-VQFN (3.5x4.5) | Surface Mount | POR | Push-Pull | 8 | Yes | 1mA，25mA | ||
|
|
|
Texas Instruments |
Quaestiones
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 20TVSOP
|
Tape & Reel (TR) | I2C | 2.5 V ~ 6 V | -40°C ~ 85°C | 20-TFSOP (0.173"，4.40mm Width) | 20-TVSOP | Surface Mount | POR | Push-Pull | 8 | Yes | 1mA，25mA |
