- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
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- Mounting Type:
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- Features:
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- Output Type:
-
- Number of I/O:
-
- Clock Frequency:
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- Current - Output Source/Sink:
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- Electus conditionibus;
Odonata Lepidoptera products 52
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Number of I/O | Clock Frequency | Current - Output Source/Sink | ||
NXP USA Inc. |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173",4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
3,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173",4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
3,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173",4.40mm Width) | 24-TSSOP | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA,25mA | ||||
Maxim Integrated |
5,222
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
Tube | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154",3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain,Push-Pull | 8 (Output Only) | 400kHz | 25mA | ||||
Maxim Integrated |
639
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 9B 16TSSOP
|
Tube | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | EEPROM,POR | Open Drain | 9 | 400kHz | 12mA | ||||
Maxim Integrated |
203
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tube | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 25mA | ||||
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
8,357
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
8,357
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | Surface Mount | POR | Push-Pull | 16 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Tape & Reel (TR) | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - | ||||
NXP USA Inc. |
2,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Cut Tape (CT) | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - | ||||
NXP USA Inc. |
2,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
- | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 8 | 1MHz | - | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
NXP USA Inc. |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | Surface Mount | POR | Push-Pull | 8 | 1MHz | 100μA,25mA | ||||
Maxim Integrated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tape & Reel (TR) | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 25mA | ||||
Maxim Integrated |
422
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Cut Tape (CT) | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain,Push-Pull | 8 | 400kHz | 25mA |