- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Features：
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- Output Type：
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- Clock Frequency：
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- Current - Output Source/Sink：
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- Electus conditionibus;
Odonata Lepidoptera products 130
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Features | Output Type | Clock Frequency | Current - Output Source/Sink | |
|
|
|
Texas Instruments |
6,000
|
III dies |
-
|
MOQ: 2000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，25mA | ||
|
|
|
Texas Instruments |
10,269
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，25mA | ||
|
|
|
Texas Instruments |
10,269
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
10,313
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
10,313
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，25mA | ||
|
|
|
NXP USA Inc. |
5,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，20mA | ||
|
|
|
NXP USA Inc. |
6,159
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，20mA | ||
|
|
|
NXP USA Inc. |
6,159
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 10mA，20mA | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | I2C，SMBus | 2.5 V ~ 3.6 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount | EEPROM，POR | Push-Pull | 400kHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,127
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | I2C，SMBus | 2.5 V ~ 3.6 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount | EEPROM，POR | Push-Pull | 400kHz | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,127
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | I2C，SMBus | 2.5 V ~ 3.6 V | -40°C ~ 85°C | 16-VQFN Exposed Pad | 16-HVQFN (4x4) | Surface Mount | EEPROM，POR | Push-Pull | 400kHz | 100μA，25mA | ||
|
|
|
Maxim Integrated |
470
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tube | 2-Wire | 2.5 V ~ 5.5 V | -40°C ~ 125°C | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | - | Open Drain | 100kHz | - | ||
|
|
|
Maxim Integrated |
615
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tube | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-WQFN Exposed Pad | 16-TQFN (4x4) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
384
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tube | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
203
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TQFN
|
Tube | I2C | 1.71 V ~ 5.5 V | -40°C ~ 125°C | 16-WFQFN Exposed Pad | 16-TQFN (3x3) | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 25mA | ||
|
|
|
Maxim Integrated |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
Tape & Reel (TR) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
4,798
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
Cut Tape (CT) | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 18mA，30mA | ||
|
|
|
Maxim Integrated |
4,798
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16QSOP
|
- | I2C，SMBus | 2.3 V ~ 5.5 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | POR | Open Drain，Push-Pull | 400kHz | 18mA，30mA | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Tape & Reel (TR) | I2C | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | Surface Mount | POR | Push-Pull | 1MHz | - |
