- Packaging:
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- Interface:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Output Type:
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- Clock Frequency:
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- Current - Output Source/Sink:
-
- Electus conditionibus;
Odonata Lepidoptera products 33
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Features | Output Type | Clock Frequency | Current - Output Source/Sink | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Features | Output Type | Clock Frequency | Current - Output Source/Sink | ||
Texas Instruments |
10,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Tape & Reel (TR) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Texas Instruments |
14,768
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Cut Tape (CT) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Texas Instruments |
14,768
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
- | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Texas Instruments |
5,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8VSSOP
|
Tape & Reel (TR) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-VSSOP | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Texas Instruments |
9,299
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8VSSOP
|
Cut Tape (CT) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-VSSOP | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Texas Instruments |
9,299
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8VSSOP
|
- | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-VSSOP | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
22,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8TSSOP
|
Tape & Reel (TR) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-TSSOP | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
23,925
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8TSSOP
|
Cut Tape (CT) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-TSSOP | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
23,925
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8TSSOP
|
- | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-TSSOP | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
4,000
|
III dies |
-
|
MOQ: 4000 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
Tape & Reel (TR) | I2C,SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | POR | Push-Pull | 100kHz | 4mA | ||||
NXP USA Inc. |
7,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
Cut Tape (CT) | I2C,SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | POR | Push-Pull | 100kHz | 4mA | ||||
NXP USA Inc. |
7,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC GPIO EXPANDER 8XQFN
|
- | I2C,SMBus | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 8-XFQFN Exposed Pad | 8-XQFN (1.6x1.6) | POR | Push-Pull | 100kHz | 4mA | ||||
NXP USA Inc. |
5,000
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Tape & Reel (TR) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SO | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
5,174
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Cut Tape (CT) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SO | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
5,174
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
- | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SO | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Texas Instruments |
265
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8SOIC
|
Tube | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8HVSON
|
Tape & Reel (TR) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8HVSON
|
Cut Tape (CT) | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
NXP USA Inc. |
232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 4B 8HVSON
|
- | I2C,SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-VFDFN Exposed Pad | 8-HVSON (3x3) | POR | Push-Pull | 400kHz | 10mA,25mA | ||||
Diodes Incorporated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER 4BIT 8MSOP
|
Tape & Reel (TR) | SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | POR | - | 1MHz | 50mA |