- Interface：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Output Type：
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- Current - Output Source/Sink：
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- Electus conditionibus;
Odonata Lepidoptera products 41
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Features | Output Type | Number of I/O | Current - Output Source/Sink | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Features | Output Type | Number of I/O | Current - Output Source/Sink | |
|
|
|
NXP USA Inc. |
2,500
|
III dies |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | POR | Push-Pull | 16 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | POR | Push-Pull | 16 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-TSSOP (0.173"，4.40mm Width) | 24-TSSOP | POR | Push-Pull | 16 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
6,000
|
III dies |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | POR | Push-Pull | 16 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,357
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | POR | Push-Pull | 16 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
8,357
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 16B 24HVQFN
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-HVQFN (4x4) | POR | Push-Pull | 16 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Tape & Reel (TR) | I2C | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | POR | Push-Pull | 8 | - | ||
|
|
|
NXP USA Inc. |
2,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
Cut Tape (CT) | I2C | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | POR | Push-Pull | 8 | - | ||
|
|
|
NXP USA Inc. |
2,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 12XQFN
|
- | I2C | 1.1 V ~ 3.6 V | -40°C ~ 85°C | 12-XFQFN | 12-XQFN (2x1.7) | POR | Push-Pull | 8 | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 6000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | POR | Push-Pull | 8 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | POR | Push-Pull | 8 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
3,626
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16HVQFN
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-HVQFN (3x3) | POR | Push-Pull | 8 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | POR | Push-Pull | 8 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
Cut Tape (CT) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | POR | Push-Pull | 8 | 100μA，25mA | ||
|
|
|
NXP USA Inc. |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16TSSOP
|
- | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | POR | Push-Pull | 8 | 100μA，25mA | ||
|
|
|
Diodes Incorporated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER 4BIT 8MSOP
|
Tape & Reel (TR) | SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | POR | - | 4 | 50mA | ||
|
|
|
Diodes Incorporated |
826
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 4BIT 8MSOP
|
Cut Tape (CT) | SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | POR | - | 4 | 50mA | ||
|
|
|
Diodes Incorporated |
826
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC I/O EXPANDER 4BIT 8MSOP
|
- | SMBus | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | POR | - | 4 | 50mA | ||
|
|
|
Diodes Incorporated |
Quaestiones
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC I/O EXPANDER 4 BIT 8-MSOP
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | - | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | - | Push-Pull | 4 | - | ||
|
|
|
NXP USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC I/O EXPANDER I2C 8B 16SOIC
|
Tape & Reel (TR) | I2C | 2.3 V ~ 5.5 V | -40°C ~ 85°C | 16-SOIC (0.295"，7.50mm Width) | 16-SO | POR | Push-Pull | 8 | 100μA，25mA |
