- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Output Type:
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- Amplifier Type:
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- Slew Rate:
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- Gain Bandwidth Product:
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Odonata Lepidoptera products 54
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of Circuits | Output Type | Amplifier Type | Current - Output / Channel | Slew Rate | Gain Bandwidth Product | Current - Input Bias | Voltage - Input Offset | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of Circuits | Output Type | Amplifier Type | Current - Output / Channel | Slew Rate | Gain Bandwidth Product | Current - Input Bias | Voltage - Input Offset | ||
Renesas Electronics America |
Quaestiones
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC OPAMP GP 3.3MHZ 8MMPAK
|
Tape & Reel (TR) | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.110",2.80mm Width) | - | 2 | - | General Purpose | 6mA | 4 V/μs | 3.3MHz | 1pA | 4mV | ||||
Renesas Electronics America |
Quaestiones
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC OPAMP GP 3.3MHZ 8TSSOP
|
Tape & Reel (TR) | -40°C ~ 85°C | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP | 2 | - | General Purpose | 6mA | 4 V/μs | 3.3MHz | 1pA | 4mV | ||||
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC OPAMP INSTR 5MHZ RRO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 5MHz | 10pA | 500μV | ||||
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 5MHZ RRO 8TDFN
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 5MHz | 10pA | 500μV | ||||
Microchip Technology |
6,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 5MHZ RRO 8TDFN
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 5MHz | 10pA | 500μV | ||||
Microchip Technology |
3,300
|
III dies |
-
|
MOQ: 3300 MPQ: 1
|
IC OPAMP INSTR 35MHZ RRO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | - | 6 V/μs | 35MHz | 10pA | 350μV | ||||
Microchip Technology |
3,692
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 35MHZ RRO 8TDFN
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 6 V/μs | 35MHz | 10pA | 350μV | ||||
Microchip Technology |
3,692
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 35MHZ RRO 8TDFN
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 6 V/μs | 35MHz | 10pA | 350μV | ||||
Microchip Technology |
2,795
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 500KHZ RRO 8SOIC
|
Tube | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 500kHz | 10pA | 3mV | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC OPAMP INSTR 5MHZ RRO 8SOIC
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 5MHz | 10pA | 500μV | ||||
Microchip Technology |
2,783
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 5MHZ RRO 8SOIC
|
Cut Tape (CT) | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 5MHz | 10pA | 500μV | ||||
Microchip Technology |
2,783
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 5MHZ RRO 8SOIC
|
- | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 5MHz | 10pA | 500μV | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC OPAMP INSTR 1MHZ RRO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 1MHz | 10pA | 2mV | ||||
Microchip Technology |
2,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 1MHZ RRO 8TDFN
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 1MHz | 10pA | 2mV | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 1MHZ RRO 8TDFN
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 1MHz | 10pA | 2mV | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC OPAMP INSTR 2.5MHZ RRO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 2.5MHz | 10pA | 850μV | ||||
Microchip Technology |
2,360
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 2.5MHZ RRO 8TDFN
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 2.5MHz | 10pA | 850μV | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 2.5MHZ RRO 8TDFN
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 2.5MHz | 10pA | 850μV | ||||
Microchip Technology |
Quaestiones
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC OPAMP INSTR 500KHZ RRO 8TDFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | - | 9 V/μs | 500kHz | 10pA | 3mV | ||||
Microchip Technology |
1,223
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC OPAMP INSTR 500KHZ RRO 8TDFN
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | 1 | Rail-to-Rail | Instrumentation | 30mA | 9 V/μs | 500kHz | 10pA | 3mV |