- Packaging：
-
- Supplier Device Package：
-
- Mounting Type：
-
- Number of Bits per Element：
-
- Electus conditionibus;
Odonata Lepidoptera products 4
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Mounting Type | Number of Bits per Element | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Package / Case | Supplier Device Package | Mounting Type | Number of Bits per Element | |
|
Toshiba Semiconductor and Storage |
Quaestiones
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC BUFFER NON-INVERT 6V 20SOP
|
Tape & Reel (TR) | 20-SOIC (0.209"，5.30mm Width) | 20-SOP | Surface Mount | 4 | |||
|
|
Toshiba Semiconductor and Storage |
644
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 6V 20SOP
|
Cut Tape (CT) | 20-SOIC (0.209"，5.30mm Width) | 20-SOP | Surface Mount | 4 | |||
|
|
Toshiba Semiconductor and Storage |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 6V 20SOP
|
- | 20-SOIC (0.209"，5.30mm Width) | 20-SOP | Surface Mount | 4 | |||
|
|
Toshiba Semiconductor and Storage |
Quaestiones
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC BUFFER NON-INVERT 6V 16DIP
|
Tube | 16-DIP (0.300"，7.62mm) | 16-DIP | Through Hole | 2，4 (Hex) |
